The two years of living during COVID-19 changed many peoples’ way of life and trading on the stock market, once seen as the sole right of large investment firms, is one such activity that has seen a massive uptake by ‘normal’ people. College students, the unemployed, and those who were simply bored, have changed the trading market. This major surge in activity has highlighted an issue that was previously not a big problem: latency on the trading networks.
In this game microseconds count. It could mean the difference between obtaining/selling a stock at the price wanted or losing out to the opposition. Wall Street, one of the largest groups of investment traders and bankers, is defined by the technology that it uses. Recently, a new trend has been seen in Wall Street. They have always leveraged technology to drive high-frequency trading (HFT) and algorithm development. However, in recent times, Wall Street has started developing its own hardware with the help of FPGA designers and system architects.
Low-latency HFT hardware architectures require high-performance signals routed throughout their infrastructure. Like data centre servers, switches, and storage applications, getting signals from the front-panel to an ASIC or another compute engine poses technical challenges.
Samtec helps enable the low latency required. Its Flyover Technology can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus legacy PCB-based designs. The proprietary co-extruded Eye Speed twinax cable technology eliminates the performance limitations and inconsistencies of traditional twinax cabling. The results include improved signal integrity, bandwidth, reach, and lower latencies for HFT systems.
Blade terminals deliver greater power density Spectrum Concepts
Interconnection
[Sponsored] Connectivity has become more important as designers pack more power into smaller spaces, all while managing thermal loads and ensuring efficiency.
Read more...Halo mid-board optical transceiver Spectrum Concepts
Opto-Electronics
The Samtec Halo mid-board transceiver has been designed for next-generation embedded applications that require 56 and 112 Gbps PAM4 performance in low profile and ruggedised form factors.
Read more...Innovation in high-frequency cable design Spectrum Concepts
Telecoms, Datacoms, Wireless, IoT
[Sponsored] With frequencies approaching 110 GHz, a mismatch in impedance, an increase in insertion loss, or minute phase distortion can be the difference between success and failure.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
Read more...Test cable designed for maximum ruggedness Conical Technologies
Interconnection
The Anoison PT test cable is designed for maximum ruggedness using a high-quality raw cable, connector, and smart armouring module.
Read more...Safe connection under load Phoenix Contact
Interconnection
The ArcZero DC connectors from Phoenix Contact can be safely connected and disconnected under load, providing operators with reliable protection against hazardous electric arcs.
Read more...Time-To-Market interconnect solutions
Interconnection
TTM Technologies are at the forefront of electrified powertrains, vehicle charging stations, and energy storage solutions, providing thermal management, high-current capabilities, and specialised solutions.
Read more...Connectors for energy storage systems Phoenix Contact
Interconnection
The new Phoenix Contact BPC series connectors are protected against polarity reversal making them ideally suited for use in energy storage systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.