Telecoms, Datacoms, Wireless, IoT


Innovation in high-frequency cable design

30 April 2025 Telecoms, Datacoms, Wireless, IoT

[Sponsored] As electronic systems continue to evolve toward higher frequencies and greater complexity, ensuring the performance of every component in the signal chain becomes vital. In RF and microwave systems, connectors and cables play a decisive role in overall system performance. For advanced systems, whether in aerospace, instrumentation, or high-speed computing, signal integrity (SI) is paramount. In these circumstances, precision RF connectors are essential.

With frequencies approaching 110 GHz, a mismatch in impedance, an increase in insertion loss, or minute phase distortion can be the difference between success and failure. This is why RF connectors designed for these frequencies are manufactured to such exacting tolerances. The precision is critical to achieving optimal performance. They ensure that signals are transmitted cleanly and consistently, without the distortions and degradations that can plague commercial-grade connectors.

However, connectors do not work in isolation. They are just one part of a larger, interdependent system that includes the cable and the broader interconnect architecture. Achieving peak performance requires an integrated approach in which every component is engineered to work as a whole. The result is a system with low signal loss, enhanced phase stability, and better electromagnetic shielding along the entire transmission path.

The design of any high-performance coaxial cable relies on controlling the critical relationship between the conductor and shield. The shield represents a compromise between delivering the best RF performance with the flexibility that a cable requires. Most manufacturers achieve this using a combination of a conductive foil or tape inner layer, paired with a woven braid that covers the foil.

Samtec’s NITROWAVE is a range of high-performance RF cables designed for microwave and millimetre wave (mmWave) applications. In common with many coaxial cables, NITROWAVE uses silver-plated copper as the material for both the foil and braid, with an FEP (Fluorinated ethylene propylene) jacket in Samtec’s signature orange colour to provide protection in some of the toughest conditions. Designed for demanding applications in the aerospace and defence markets, along with instrumentation and computing industries, the FEP jacket delivers a high working temperature and resistance to abrasion.

However, an unseen feature of NITROWAVE is the dynamic performance layer (DPL). The DPL is a key component in the cable’s construction, made from a layer of PTFE between the foil and braid shields. Although thin, the DPL plays a critical role in NITROWAVE’s mechanical and electrical performance. Its primary intention is to eliminate friction between the two elements of the shield, allowing the braid to move freely over the foil without damaging it. The DPL also improves overall reliability. Its PTFE layer wraps around the helical foil shield, improving the cable’s strength when flexing. It provides an interface between the delicate foil and the woven braid that surrounds it, reducing the risk of conductive oxidation. The result is a cable with a higher flex cycle life and improved durability.

Enhancing RF performance

The advantages of the DPL are not limited to improved mechanical performance. These improved physical properties also enhance electrical performance. DPL provides better phase stability. Phase is the name given to the position of a wave at a specific point in time within its cycle and is important when considering how RF signals travel along cables. A phase shift is therefore a change in the position of the wave, usually caused by external forces such as bending of the cable or changes in its temperature. Greater phase stability results in more consistent RF signals, even when the cable itself is flexing.

The DPL layer also helps to reduce capacitive coupling. This is a side effect created by the two separate shield layers. If in close contact, the layers act as the plates in a capacitor. Even the tiny amounts of electrical charge that can build up between the layers have the potential to create unwanted noise, which will have an impact on signal integrity. A thin PTFE layer such as that used in NITROWAVE is sufficient to minimise this coupling and improve overall SI performance.

NITROWAVE for all applications

The performance of NITROWAVE may suggest that it is suitable only for the most demanding applications. Some customers may decide against using a cable intended for 110 GHz performance in their design. However, NITROWAVE is not one product. Instead, it is a family of cables, each optimised for different frequencies ranging from 18 GHz up to a maximum of 110 GHz. These frequencies were selected with care following extensive studies of customer requirements, with each cable designed to minimise insertion loss across its operating frequency range.

Conclusion

NITROWAVE cables are designed to deliver superior performance in combination with Samtec’s range of Precision RF connectors. Engineered to the same tight tolerances, these connectors ensure optimal signal integrity and mechanical reliability across the entire signal path.

Whether operating at mmWave frequencies or in harsh environmental conditions, the combination of NITROWAVE cables and Samtec Precision RF connectors delivers a fully integrated, high-performance interconnect solution. Visit the Samtec website [www.samtec.com] for an in-depth view of the features of NITROWAVE. You can also download the guide to precision RF design [suddendocs.samtec.com/literature/samtec_precision_rf_design_guide.pdf].


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Meeting the demands of mmWave with Samtec high-performance RF solutions
Spectrum Concepts Interconnection
[Sponsored] The appetite of modern technology for ever-higher data rates and transmission speeds seems to be insatiable, and this is especially apparent in the drive towards mmWave technologies.

Read more...
Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved