AMD 7 series FPGAs and SoCs
29 March 2023
DSP, Micros & Memory
In November 2022, AMD announced that the lifecycle of all 7 series FPGAs and SoCs would be extended through at least 2035. While this is great news for anyone who already has 7 series in existing products, one may wonder if it makes sense to start new designs with the 7 series devices. The answer is a definite yes!
This webinar will show where 7 series products provide optimal value and performance in designs, contrasting them with newer products such as the AMD Artix UltraScale+ and AMD Zynq UltraScale+ families.
This webinar will cover the following:
• Details of the 7 series extension through at least 2035 will be reviewed.
• The differences between FPGA and SoC product offerings will be explored including when one should choose 7 series devices for a new design.
• An overview of resources such as webpages, development boards, example designs, and trainings will be provided.
• A chance to win one of five Digilent Cora Z7 boards will be on offer.
Date: 5 April 2023
Time: 18:00 CAT
Further reading:
Cost-effective microcontroller series
Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
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Battery-friendly Thread and BLE solution
iCorp Technologies
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Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
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Next generation HMI processing platform
Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
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Low-power SoC for IoT designs
iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
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Chip for high-density power
Future Electronics
DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.
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The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.
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GigaDevice expands GD25UF Series density
NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
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ARINC 429 line driver evaluation board
ASIC Design Services
DSP, Micros & Memory
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.
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Highly integrated 24-channel mixed signal IC
EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
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Lower-power Thread and BLE connectivity
iCorp Technologies
DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
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