Interconnection


AcceleRate extreme density and performance systems

26 April 2023 Interconnection

Samtec’s family of board-to-board and cable assemblies feature extreme density with up to 1000 total I/Os on a 0,635 mm pitch, while still providing incredible 112 Gbps PAM4 performance.

The AcceleRate HD family of high-density arrays feature up to 400 Edge Rate contacts in a slim, low-profile design. With a body width of 5 mm and stack heights from 5 to 16 mm, incredible space savings can be realised. The open-pin-field design allows for maximum grounding and routing flexibility. AcceleRate HD supports 56 Gbps PAM4 applications and is PCIe 5.0 capable.


The AcceleRate HP family of high-performance arrays operate up to 112 Gbps PAM4 which is data rate compatible with PCIe 5.0 and 100 GbE. The 4-row design allows up to 400 total I/Os with 1000+ I/Os in the pipeline. This cost-optimised solution has a stack height from 5 to 10 mm.

Samtec also offers AcceleRate HP cable-to-board solutions, which offer a 112 Gbps PAM4 rated connection. These cable solutions are available in 32 to 72 differential pairs on a 0,635 mm contact pitch, with a staggered row-to-row pitch of 2,2 x 2,4 mm. This allows adequate routing lanes for optimised differential pair traces. This cable system is ideal for AI, HPC and data centre applications.


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