With the step-function increase in data collected and transmitted from cloud-connected edge nodes, Improved Inter Integrated Circuit (I3C) is rapidly becoming a more sustainable solution for interfacing sensors with a high data rate, and will help expand capabilities in next-generation devices.
Leading the way in I3C integration, Microchip Technology has released its PIC18-Q20 family of microcontrollers, the industry’s first low pin count MCUs with up to two I3C peripherals and Multi-Voltage I/O (MVIO). Compared to I2C, I3C offers higher communication rates and lower power consumption, all while maintaining backward compatibility with legacy systems.
With I3C functionality, flexible peripherals and the ability to operate on three independent voltage domains, PIC18-Q20 MCUs are well suited to be used in conjunction with a primary MCU in a larger overall system. This family of MCUs can perform tasks such as processing sensor data, handling low latency interrupts and system status reporting that the main MCU cannot perform as efficiently. While the CPU runs at a different voltage domain, the I3C peripheral operates from 1,0 to 3,6 V.
Available in 14- and 20-pin packages as small as 3 x 3 mm, the PIC18-Q20 MCUs are a compact solution for real-time control, touch sensing and connectivity applications. They are ideal for a wide range of applications including automotive, industrial control, computing, IoT and medical.
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
Read more...Compact MCU for IoT endpoints iCorp Technologies
DSP, Micros & Memory
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Advanced sensing powers modern drones Future Electronics
DSP, Micros & Memory
Allegro MicroSystems has a portfolio of sensors, motor drivers, and power management devices specifically designed to enhance drone efficiency, reliability, and control.
Read more...Addressing latency and signal integrity challenges Altron Arrow
DSP, Micros & Memory
Strengthening Microchip Technology’s data centre solutions portfolio, its XpressConnect retimers support high-bandwidth architectures, while helping reduce integration complexity.
Read more...High-precision thick-film resistors Avnet Silica
Passive Components
The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.
Read more...ESP32-S31 for advanced IoT iCorp Technologies
DSP, Micros & Memory
At the heart of the device is a dual-core 32-bit RISC-V MCU operating at up to 320 MHz, delivering 6,86 CoreMark/MHz performance with MMU support for efficient memory management.
Read more...Cortex-M33 performance for cost-sensitive designs Future Electronics
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.
Read more...Ideal entry point into edge AI Avnet Silica
AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version