Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE. The WE310K6 enables device OEMs to add high-speed wireless connectivity quickly and cost-effectively to its products, even when they have limited Bluetooth and Wi-Fi expertise.
The Realtek RTL8822BE-CG used in the WE310K6 is a highly integrated single-chip that supports 2-stream 802.11ac solutions with Multi-User Multiple-Input, Multiple-Output (MU-MIMO) and Wireless LAN PCIe network interface controller and integrated Bluetooth 2.1/3.0/4.2 USB interface controller. It combines a WLAN MAC, a 2T2R capable WLAN baseband, and RF in a single chip. The RTL8822BE-CG provides a complete solution for a high-performance integrated wireless and Bluetooth device.
The WE310K6 also has IEEE 802.11 and Bluetooth SIG certifications and complies with Wi-Fi Alliance and Bluetooth SIG-v5.2 requirements. OEMs can get new products to market faster by reducing RF design time and removing the burden of testing and certification. The module’s other key features and benefits include:
• Two form factor options: LGA package or on top of an M.2 Key E carrier board.
• Host-activated Wi-Fi and Bluetooth radios.
• Dual-stream spatial multiplexing up to 1201 Mbps.
• MU-MIMO technology.
• Bluetooth Low Energy AUDIO Isochronous Channel support.
• Compatible with Wi-Fi 802.11 e, h, k and i.
• Advanced security (including WPA3) with integrated cryptographic hardware.
• Industrial-grade temperature range of -40 to 85°C to ensure reliability even in demanding environments.
Supporting 802.11 a/b/g/n/ac/ax, classic Bluetooth and Bluetooth Low Energy 5.2, the WE310K6 gives OEMs the flexibility to design products that can connect to other local devices, or to the internet over Wi-Fi. The module is ideal for a wide variety of consumer and business applications, including:
• Smart home: home automation, appliances, home security and alarms, smart lighting, and IP cameras and speakers.
• Health care and medical: remote patient monitoring, medical wearables, and healthcare and wellness devices.
• Industrial and commercial: energy management, robotics, and industrial and building automation.
• Other applications: aftermarket OEM telematics, fleet management, smart cities and parking, asset management, and general trackers.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.