Mouser Electronics is now stocking the Pro 4G module from Arduino. Powered by a powerful Quectel LTE Cat 4 modem, the Pro 4G module’s fast data throughput and high bandwidths ensure reliable and quick data download and upload, even in remote locations. The Pro 4G module expands the connectivity capabilities of Portenta boards for use in smart city infrastructure, industrial automation, fleet management systems, remote maintenance, and other applications.
The Arduino Pro 4G module guarantees reliable 4G connectivity and backward compatibility with existing 2G and 3G networks. The module connects devices through Arduino Cloud, simplifying error analysis, firmware updates, and remote maintenance. For larger projects such as smart buildings, the modules can be used to remotely monitor temperature, moisture, and deformity levels, accelerating response times when safety is at risk. The Pro 4G module is also an effective connectivity solution in challenging environments, providing long-range coverage and secure data transfer both indoors and outdoors.
Developed in the widely accepted Mini PCIe form factor, the Pro 4G module is compatible with a vast range of applications, including pipeline monitoring, smart parking, and waste management.
1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...From idea to intelligent product TRX Electronics
Computer/Embedded Technology
Mouser Electronics has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino UNO Q Helps Designers Go from Idea to Intelligent Product.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
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