31 Jul 2025Manufacturing / Production Technology, Hardware & Services
Achieving zero defects in printed circuit board assemblies (PCBAs) demands rigorous validation on both the component level and system level. SPEA highlights two complementary methodologies – in‑circuit testing (ICT) and functional testing (FCT) – that together provide a holistic, layered approach to quality control and root‑cause diagnostics.
What is in‑circuit testing?
ICT is a white‑box test method that inspects the electrical integrity of individual components and their connections early in the manufacturing process. It identifies soldering defects, component value errors, open and short circuits, and misplacements before the board is powered up – significantly reducing the risk of damaging equipment or the PCBA itself.
Some critical advantages include:
• Component‑level diagnostics: Exact identification of faulty or missing components, incorrect values, and orientation errors.
• Production insights: ICT generates data that, when fed back through MES or quality systems, supports trend analysis and process improvement.
• High throughput: Especially when using bed‑of‑nails testers that support multi-site, parallel testing for efficiency.
Both bed‑of‑nails and flying probe testers can be used for ICT. Bed‑of‑nails testers use fixed spring‑loaded probes contacting test pads in parallel and are best suited for large production volumes thanks to speed and repeatability. Flying probe testers use mobile probes to sequentially contact single points making them flexible and ideal for low volume, rapidly changing designs.
What is functional testing?
While ICT digs into how the board was built, functional testing (FCT) confirms if it works as intended. Under realistic power and signal conditions (regulated voltages, I/O behaviour, frequency responses), FCT delivers a pass/fail verdict by testing the board’s integrated functionality. This testing is essential to catch design flaws, firmware issues, and system‑level interactions that ICT simply cannot detect.
SPEA integrates both ICT and FCT into bed‑of‑nails testers for seamless, high-throughput validation. The company’s machines like the T300 tester employ a multi-core architecture and support up to 32 simultaneous ICT cores and 256 cores for flashing and functional testing, enabling throughput up to 10x faster than conventional systems.
They extend conventional ICT with advanced measurements for weak components, analogue/digital fault boundaries, flashing, and dynamic tests. Dual-site operation is supported with robot loading/unloading, and controller integration for high autonomy and minimal operator reliance.
Collaboration is now critical RS South Africa
Manufacturing / Production Technology, Hardware & Services
The message emerging from RS Connect is clear: Organisations can no longer rely on internal optimisation alone to secure performance. Competitive advantage is increasingly being determined by the strength of external relationships, shared capability and coordinated action across value chains.
Read more...Disruption is the new normal. Effortless is the new competitive advantage. Seven Labs Technology
Manufacturing / Production Technology, Hardware & Services
Global supply chains have been under pressure for years. The manufacturers still standing are the ones who stopped waiting for normal to return, and started building something better.
Read more...World-first 016008 mm component placement
Manufacturing / Production Technology, Hardware & Services
Fuji has achieved the world’s first placement of 016008 mm (0,16 x 0,08 mm or 006 x 003 inches) size components on printed circuit boards with its SMT pick and place machine, NXTR.
Read more...Lifecycle and obsolescence: Protecting electronics through process Production Logix
Manufacturing / Production Technology, Hardware & Services
At Production Logix, we believe longevity is not accidental. It is engineered through early visibility, structured response, and disciplined execution, in partnership with our OEM customers.
Read more...Maximising squeegee quality and durability Testerion
Manufacturing / Production Technology, Hardware & Services
Transition Automation has announced two new product advancements designed to improve SMT printing performance and extend squeegee life: laser-enhanced Permalex bonding and integrated edge protectors.
Read more...NeoDen ND2 PCB screen printer ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The NeoDen ND2 PCB screen printing machine is a fully automatic stencil printer designed to deliver precise and consistent solder paste application in modern SMT production environments.
Read more...Understanding the BGA rework process Techmet
Manufacturing / Production Technology, Hardware & Services
BGA rework is a highly technical process that involves removing the faulty component, preparing the circuit board, and installing a new or repaired device, while maintaining the integrity of the printed circuit board.
Read more...Flexible three-process reflow soldering system Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
Read more...Inline vapour phase soldering for high-volume production MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
Read more...Global electronics solutions since 1964 IMP Electronics Solutions
Manufacturing / Production Technology, Hardware & Services
Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version