Espressif has introduced the ESP32-H21, a low-power wireless SoC designed for always-connected IoT nodes that rely on Thread, Matter, Zigbee, and Bluetooth LE. Positioned as an incremental upgrade to the ESP32-H2, the ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
The SoC targets applications such as smart-home and building automation sensors, Matter-enabled endpoints, Bluetooth mesh lighting nodes, occupancy and environmental monitors, and asset-tracking devices. With IEEE 802.15.4 and BLE onboard, the ESP32-H21 supports low-power mesh networking across multiple protocols. Espressif specifies RX active current at about 8,2 mA with the DC-DC converter enabled, while light-sleep and deep-sleep modes achieve approximately 9 µA and 5 µA respectively. Support for up to 20 dBm transmit power improves range and reliability in dense RF environments.
Powered by a 96 MHz 32-bit RISC-V MCU, the device integrates 320 kB SRAM and 128 kB ROM, with external flash support for larger applications. Up to 19 GPIOs and a full peripheral set, including UART, SPI, I2C, I2S, PWM, ADC, and timers, allow compact integration of sensors and user interfaces.
Cost-effective microcontroller series Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
Read more...Next generation HMI processing platform Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
Read more...DC-DC converters for next-generation IoT iCorp Technologies
Power Electronics / Power Management
AIPUPOWER’s K78XXJT-500R3 and K78XXJT-500R3-LB give designers a compact, high-efficiency power option for battery-powered and space-constrained systems, combining up to 96% efficiency with no-load input current as low as 0,2 mA.
Read more...Compact edge platform for AI iCorp Technologies
AI & ML
Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
Read more...Low-power SoC for IoT designs iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
Read more...Chip for high-density power Future Electronics
DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.
Read more...The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.
Read more...NVDC power-path control to 1– 6 cell battery systems iCorp Technologies
Power Electronics / Power Management
SG Micro’s SGM41581 is an I2C-controlled narrow voltage direct charging buck boost charge controller designed to simplify robust power delivery in systems that must seamlessly operate from an adapter input or a battery pack.
Read more...GigaDevice expands GD25UF Series density NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.