[ADVERTORIAL] A COM-based SBC combines the flexibility of a standard computer-on-module (COM) with a baseboard offering additional I/O, expansion sockets, power supplies, and I/O connectors. The result is a highly flexible, highly expandable, feature-dense product that can be adapted to the widest range of applications, offering maximum product lifetime.
Benefits of COM-Based SBCs
• Scalable CPU performance: you can swap out one COM for another in the exact same form factor, but with a different CPU. This allows your system to be easily upgraded when software demands increase.
• Extended product lifetime: if the COM you are using becomes obsolete, another one can be used in its place easily, with no mechanical changes required to the system. This enables COM-based embedded systems to easily last 20 years, since most of the baseboard electronics usually have much longer lifecycles than the processor and related peripherals contained on the COM.
• Higher feature density/smaller overall size: the stacked 2-board design means you get more features per unit area in your system. Many of Diamond Systems COM-based SBCs are able to include integrated data acquisition circuitry and additional I/O for this reason, earning them the additional distinction of “2-in-1” SBCs.
• Earlier access to the latest CPU technology: Most new processors are introduced in COMs long before they are available in true single-board computer form. With a COM-based SBC you can upgrade your system with the latest CPU sooner.
• Consistent platform across product lines: the CPU scalability and interchangeability mean that a single physical form factor can be used in multiple applications requiring different CPU capability, with no mechanical redesign required.
A COM-based SBC separates the high-development-cost, high-technical-complexity, higher likelihood of obsolescence, and overall higher-risk CPU circuit from the generally easier-to-design and longer-life I/O, expansion, and power circuitry. This makes a COM-based SBC desirable from the standpoint of design effort, manufacturability, and sustainability, while also significantly alleviating risk to a program with long life expectancy.
This division of complexity and risk also makes it appealing to choose a custom COM-based solution in many cases. A custom COM carrier board can be designed in much less time and for much lower cost than a fully custom SBC.
Next-Gen Min-ITX motherboard Vepac Electronics
Computer/Embedded Technology
Adding to AAEON’s extensive industrial motherboard portfolio, the Next-Gen MIX-Q870A1 is the company’s most advanced Mini-ITX board to date.
Read more...Rev 2.0 PolarFire FPGA ethernet sensor bridge Altron Arrow
Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
Read more...Intelligent video processing Rugged Interconnect Technologies
Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.
Read more...Nordic expands nRF Cloud with firmware vulnerability scanning RF Design
Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
Read more...Arrival of the Epic-PTH9 Vepac Electronics
Computer/Embedded Technology
AAEON introduces the EPIC-PTH9, a compact 4-inch industrial single-board computer powered by Intel Core Ultra Series 3 (formerly Panther Lake) processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version