Delivering up to 6 A of continuous output current, the DCP0606Y from STMicroelectronics enables efficient regulation of low-voltage rails commonly used in modern vehicle electronics and industrial systems.
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Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
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NXP has significantly expanded its MCX A Series of Arm Cortex-M33 microcontrollers, doubling the portfolio with six new families aimed at industrial and IoT edge applications.
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By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.
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NXP has enabled BCS on the MCX W72 multi-protocol wireless MCU, which supports Bluetooth Low Energy 6.0, Thread, Zigbee, and Matter.
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The SimpleLink Wi-Fi CC33xx family of devices from Texas Instruments are dual-band Wi-Fi 6 companion modules enabling engineers to connect more applications with confidence.
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Microchip’s MCPF1525 power module with PMBus delivers 25 A DC-DC power and is stackable up to 200 A.
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The TI TPS7A57-Q1 is an automotive-grade, high-performance low-dropout linear regulator, engineered for precision power delivery in noise-sensitive systems.
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The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.
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The collaboration between Microchip and Hyundai aims to evaluate and promote the adoption of advanced in-vehicle network technologies leveraging each company’s strengths.
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STMicroelectronics has expanded its industrial processing portfolio with the new STM32MP2 series, a family of application microprocessors designed to deliver higher performance, advanced security and long-term reliability for cost-sensitive industrial IoT systems.
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The Taoglas Metal Stamped MPA Series of antennas is engineered to meet the growing demands of modern wireless devices that require high performance in increasingly compact form factors.
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