The TPS25985x from Texas Instruments is a 4,5 to 16 V, 0,59 mO, 80 A stackable compact eFuse with an accurate current monitor.
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Infineon’s first completely autonomous 60 GHz radar sensor MMIC, the BGT60LTR11AIP, is a fully integrated microwave motion sensor including Antennas in Package (AIP) and integrated detectors for motion and direction of motion.
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Radar is a powerful, cost-effective replacement for conventional PIR sensors, and Infineon’s Xensiv 60 GHz radar chip is here to revolutionise motion detection.
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In the category of connectivity at the recent 2022 LEAP Awards, the Gold was awarded to Silicon Labs’ BG24 and MG24 families of 2,4 GHz wireless SoCs.
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During CES 2023, Infineon will be providing an exclusive preview of the latest technologies that enable intelligent and secure IoT solutions for a sustainable future.
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Matter is an automation connectivity standard that has been designed with the main purpose of reducing fragmentation across IoT products from different vendors, and this will transform the automation landscape by achieving interoperability among smart home platforms.
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Prototyping RF designs with the X-Microwave modular system can dramatically reduce the time and resources needed to test an RF signal chain by enabling clean, modifiable, near-PCB prototypes through 60 GHz to be built and tested in a single afternoon.
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Nvidia has announced the Jetson Orin module with Ampere Architecture GPU, fast memory bandwidth and high-speed IO, the perfect solution for next generation AI and robotics applications.
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Combining the native ML processing capabilities of NXP’s i.MX applications processors with dedicated ML accelerators from NXP ecosystem partners such as Kinara, creates an even larger scalability range than that offered by NXP alone, while still maintaining software reuse.
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Microchip has announced the PIC32CXMT family of 32-bit microprocessors with a new MPL460 power line communication (PLC) modem integrated into the SoC.
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Infineon has announced the XDPS2221, the first IC on the market that combines both PFC boost and hybrid flyback conversion features in a single package.
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The TMAG5173-Q1 from Texas Instruments is a low-power linear 3D Hall-effect sensor which integrates three independent sensors in the X, Y, and Z axes.
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