EBV Electrolink

Tel: +27 11 236 1900
Email: [email protected]
www: www.ebv.com
more information about EBV Electrolink

Trimension family secures car access
29 November 2024, Telecoms, Datacoms, Wireless, IoT

The Trimension NCJ29Dx family is part of NXP’s portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range MCU.
read more


Entry-level MCU with classical peripherals
30 August 2024, DSP, Micros & Memory

NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
read more


QLC Flash memory with the latest BiCS technology
31 July 2024, Analogue, Mixed Signal, LSI

KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
read more


Webinar: Game-changing Matter standard
30 April 2024, Telecoms, Datacoms, Wireless, IoT

Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
read more


General-purpose MCU with RISC-V architecture
30 April 2024, DSP, Micros & Memory

Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
read more


AI-native IoT platform launched
30 April 2024, AI & ML

These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
read more


Serial SRAM up to 4 MB
30 April 2024, DSP, Micros & Memory

The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
read more


Microchip expands its mSiC solutions
28 March 2024, Power Electronics / Power Management

The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
read more


Powering up the intelligent edge
28 March 2024, DSP, Micros & Memory

STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
read more


Flash for AI
28 March 2024, AI & ML

SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
read more


UFS Ver. 4.0 embedded Flash memory devices
29 February 2024, Computer/Embedded Technology

KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
read more


InnoSwitch5 Offline Flyback Switcher IC
29 February 2024, Power Electronics / Power Management

ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
read more





<< First   < Previous   Page 2 of 100   Next >   Last >>