Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

Diplexer for WLAN and Bluetooth
14 May 2014, Passive Components

TDK has developed a new multilayer diplexer in case size IEC 1005 for the implementation of 2,4 GHz/5 GHz band WLAN in smartphones and other mobile devices. With its miniature dimensions of 1,0 x 0,5 ...
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Silicon ESD protectors
14 May 2014, Circuit & System Protection

Design engineers are well aware that providing ESD (electrostatic discharge) protection according to the IEC’s 61000-4-2 standard can fall short when guarding against the more severe damage caused by ...
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MEMS microphone with high SNR
14 May 2014, Analogue, Mixed Signal, LSI

The new C928 type MEMS microphone from TDK is distinguished by its particularly high signal-to-noise ratio (SNR) of 66 dB(A) in the frequency range between 20 Hz and 20 kHz. It is thus particularly well ...
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Touch screen controller
23 April 2014, Analogue, Mixed Signal, LSI

FTDI Chip has expanded its Embedded Video Engine (EVE) offering with the introduction of the FT801, which supports intelligent display implementations with capacitive touch screens. The new device possesses ...
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Connector for thin LED lighting modules
23 April 2014, Interconnection

Molex announces its new Lite-Trap SMT wire-to-board connector system featuring an overall compact size that meets the needs of thin LED lighting module applications. With a profile height of just 4,20 ...
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Chip-on-board LED holders
2 April 2014, Interconnection

Molex produces a range of solderless chip-on-board (COB) LED holder solutions for mounting COB LED arrays into luminaires. These holders make it very easy to integrate LEDs into a lighting fixture without ...
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Micro USB 2.0 connector
12 March 2014, Interconnection

As consumer products are getting thinner and smaller, they are becoming increasingly vulnerable to water and dust. Being able to support electronic devices with splash-proof and dust-proof components ...
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Bluetooth Smart module
12 March 2014, Telecoms, Datacoms, Wireless, IoT

TDK has produced an ultra compact Bluetooth low energy module designed for the Bluetooth 4.0 low energy (LE) specification, which is being marketed as Bluetooth Smart. With its footprint of just 4,6 x ...
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High-speed backplane connectors
19 February 2014, Interconnection

TE Connectivity’s new Impact backplane connector system is designed for increased speed and density to meet the future system upgrades and next-generation requirements of data networking and telecommunications ...
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New solder paste and wire from Balver Zinn
29 January 2014, Manufacturing / Production Technology, Hardware & Services

The Balver Zinn Group débuted a new solder paste and wire at productronica in November.    OT2 is Cobar’s latest halide- and halogen-free solder paste technology whose optimised rosin-based chemistry ...
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Ceramic transient voltage suppressors
29 January 2014, Circuit & System Protection

The Epcos range of ceramic transient voltage suppressors from TDK are voltage-dependent resistors with symmetrical V/I characteristic. Their resistance value decreases with increasing voltage, effectively ...
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High-sensitivity GPS module
29 January 2014, Telecoms, Datacoms, Wireless, IoT

The Locosys MC-1108 GPS module, powered by MediaTek, provides high sensitivity and performance even in urban canyon and dense foliage environments. It supports hybrid ephemeris prediction to achieve ...
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