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Using SAFI-Tech’s platform, liquid metal is encapsulated in a proprietary soft shell, keeping the solder alloy in a sub-cooled (liquid) state far below its normal melting/freezing point.
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: Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications.
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Common failure modes in flip-chip assembly will be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
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Indium Corporation earned Electronics Manufacturing World’s innovation award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance.
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The NPM-WX, the latest generation of the NPM platform, is the perfect solution for the expanding and digital future in electronics assembly.
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Indium Corporation will be showcasing its GalliTHERM liquid metal technology together with its no-clean semiconductor flux at SEMICON to be held in Taiwan.
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Indium Corporation has earned an excellence award from Allegro MicroSystems for the efforts of its Asia-Pacific operations in delivering quality, on-time products during the 2021 fiscal year.
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Panasonic’s SPG2 high-speed screen-printing machine is tailored to SMT manufacturing and comes equipped with multi-stage board handling to improve productive time.
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1 Click SMT Technology Company has introduced its new Unit-i1 latest generation compact inline selective soldering machine as a full-function station with fluxing-preheating-soldering-inspection capabilities.
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Indium Corporation is partnering with SAFI-Tech, an Iowa-based start-up that is creating no-heat and low-heat solder and metallic joining products.
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Indium Corporation introduces two new solder pastes designed for the higher processing temperatures required for use in high-power LED module arrays.
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Indium Corporation boasts an extensive portfolio of innovative, high-performance metal thermal interface materials (TIM), some of which will be featured at the impending TestConX conference in Arizona,
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