AVX has released two new medium-power film capacitor series designed for DC filtering applications, such as DC link or resonant filters, spanning 1500 to 3000 V d.c. Comprised of segmented, dry, metallised ...
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Bourns announced the release of a new surge protection product model TISP4G024L1W – for protecting ADSL, VDSL and G.Fast interfaces. The xDSL protector is designed to be placed between the xDSL line ...
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Based upon an industry standard 8051-­compatible processor core, the FT51A from FTDI Chip brings enhanced I/O bridging to 8-bit MCU technology with integrated USB device and hub port capabilities, ideal ...
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FTDI Chip has introduced a series of easy-to-utilise modules to facilitate the evaluation, development and subsequent implementation of its 32-bit FT90X Super-Bridge microcontrollers (MCU). Optimised ...
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Included in PAIRUI’s extensive range of power conversion products is an assortment of AC-DC models in miniature and fully encapsulated plastic and metal packages. The ASM-15, ASM-20 and ASM-30, with 15 ...
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TE Connectivity introduced three low-profile block connectors, including the 0.3H block SIM card connector, 0.3H block side-entry SIM connector and 0.3H block micro SD connector. The block solution in ...
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Bourns has released a 15 V bidirectional, high-current power TVS (transient voltage suppression) diode, extending the range of the existing PTVS3 series. This model (PTVS3-015C-TH) was designed for use ...
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The UNO R3 is the staple of most Arduino-based projects but it’s been around for a number of years and many of the features have been improved, for example by Adafruit and Sparkfun which make excellent ...
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The new B82805* series of EPCOS SMD push-pull transformers features compact dimensions of just 9 x 8 x 5,7 mm, and windings with centre taps located on both the primary and secondary side. The series ...
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TE Connectivity expanded its Corcom three-phase filter offering with new high-current models ranging from 250 to 1600 A. The new models are specifically designed to support alternative energy inverter ...
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FTDI Chip has added to the support it can offer to engineers using its X-Chip series by introducing an array of new breakout boards. Through these compact, low-profile boards, the bridging of USB 2.0 ...
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TE Connectivity’s PolyZen YC/YM devices offer coordinated circuit protection from damage caused by ESD (electrostatic discharge) or other electrical over-stress events. Due to technology limitations, ...
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