The new modular placement system mixes a wide variety of machine layouts together with a range of options to offer an optimum line suitable for all types of production.
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1 Click SMT Technology Company’s Unit-i1 is a compact inline selective soldering machine that combines a drop jet fluxer nozzle, bottom IR preheater, selective solder pot, and automated optical inspection (AOI) function.
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JTU’s second-generation reflow oven is hands-free and fully automatic, and is equipped with automation features such as automatic recipe switching using barcodes, and automatic conveyor width adjustment according to recipe.
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Saki Corporation has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards.
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Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its flux-cored wire, CW-818.
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Indium has earned a BISinfotech BETA award as global leader in the solder and materials category, making it the third consecutive year Indium has received a BETA award.
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Even with its compact dimensions and attractive price, this inline selective soldering machine does not require the user to make any compromises in terms of quality and throughput.
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With all the different Pb-free solder pastes on the market today, how does anyone choose the correct solder paste that will ensure finished goods reliability?
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Using SAFI-Tech’s platform, liquid metal is encapsulated in a proprietary soft shell, keeping the solder alloy in a sub-cooled (liquid) state far below its normal melting/freezing point.
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: Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications.
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Common failure modes in flip-chip assembly will be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
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Indium Corporation earned Electronics Manufacturing World’s innovation award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance.
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