Future Electronics

Tel: +27 21 421 8292
Email: [email protected]
www: www.futureelectronics.com
more information about Future Electronics

Power relays for energy management applications
28 February 2025, Power Electronics / Power Management

The Panasonic Industry HE-R Series is an energy management relay designed for single-phase or 3-phase AC charging units, combining high capacity, high switching, and low operating power into a small size power relay.
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Advanced eMMC storage solutions
28 February 2025, DSP, Micros & Memory

Alliance Memory provides advanced NAND flash memory storage solutions that follow the JEDEC eMMC v5.1 standard to meet the growing demand for efficient, high-capacity storage solutions in today’s digital era.
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NPU in the most powerful STM32 processor
28 February 2025, DSP, Micros & Memory

The STM32N6 is STMicroelectronics’ newest and most powerful STM32 and the first to come with the company’s Neural-ART Accelerator, a custom NPU capable of 600 GOPS.
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E-mobility innovation: balancing power, sensors, and connectivity
EMP 2025 Electronics Manufacturing & Production Handbook, Manufacturing / Production Technology, Hardware & Services

The future of e-mobility is being shaped by innovations in power systems, connectivity, and sustainable design, and this article explores key technologies driving the industry forward.
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ST’s biosensing tech enables next-gen wearables
29 November 2024, DSP, Micros & Memory

The highly integrated biosensor device combines an input channel for cardio and neurological sensing, with motion tracking and embedded AI core, for healthcare and fitness applications.
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1700 V GaN Switcher IC
29 November 2024, Power Electronics / Power Management

Power Integrations has introduced a new member of its InnoMux-2 family of single-stage regulated multi-output offline power supply ICs, the industry’s first 1700 V gallium nitride switch.
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32-bit range of MCUs
31 October 2024, DSP, Micros & Memory

If your design has outgrown the capabilities of 8- or 16-bit MCUs, the PIC32 family delivers easy scalability, enhanced performance, and larger memory options.
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Moulded inductors
31 October 2024, Passive Components

Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
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i.MX RT700 for the AI-enabled edge
31 October 2024, DSP, Micros & Memory

Designed to enable significant power savings, the highly integrated i.MX RT700 crossover MCU features NXP’s eIQ Neutron Neural Processing Unit, delivering up to 172x AI acceleration at the edge.
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The future of on-board charging
30 September 2024, Passive Components

Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
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Acceleration sensors for wearables
30 September 2024, Test & Measurement

Bosch Sensortec has introduced two new acceleration sensors, the BMA530 and BMA580, both offered in a compact size of only 1,2 x 0,8 x 0,55 mm.
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Compact MCU with advanced customisation
30 September 2024, Telecoms, Datacoms, Wireless, IoT

The Microchip PIC16F13145 is the ideal solution for designs with minimal logic and configurable analogue I/O, featuring rapid comparators for improved data acquisition.
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