23 June 2021Manufacturing / Production Technology, Hardware & Services
Scienscope, a leading American supplier of cabinet style micro-focus X-ray systems, announced a new promotional sale valid until 30 June 2021, on two of its component management systems: the AXC- 800 III and IMS-100 component counters. They are on sale separately or can be purchased as a bundle for further savings.
Scienscope offers a fully automated solution to help achieve full integration and management of components. Its systems come with a wide range of features to help reduce labour and cost in any factory.
The AXC 800-III is capable of counting components from strips, trays, sticks, 15-inch reels, 13-inch reels, or even four 7-inch reels at the same time. It is easy to use by simply placing the reel and locking the door – the system begins counting automatically and prints a label when it finishes.
The IMS-100 makes incoming material integration easier than ever by reading any type of label with 1D or 2D barcodes and even features OCR (optical character recognition). As time is a critical issue, this machine can read four 7-inch reels simultaneously and the integration begins automatically. A unique ID (internal label) is printed after each reel is removed, making it easier to have traceability down to the component level and to implement a FIFO (first-in first-out) type of production.
Scienscope offers full integration with EMS/ERP platforms in seconds and without error, allowing for production personnel to access the system and know where and which products are available.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...UV curing oven for high-efficiency PCB production Techmet
Manufacturing / Production Technology, Hardware & Services
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.
Read more...Automatic stencil cleaning ZETECH ONE
Manufacturing / Production Technology, Hardware & Services
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version