Editor's Choice


PCIe 7.0 technology. Too soon or not fast enough?

29 November 2024 Editor's Choice

Many technologists seem to agree on one thing: innovation has never been faster. Why?

AI. The race is on to offer differentiated hardware solutions for optimised AI performance at the edge and in the data centre.

Data scientists, AI system architects, IC designers, optical engineers, interconnect providers like Samtec, and other solutions providers, are rethinking system topologies. GPU clustering, disaggregated computing, cache-coherent memory, optical interconnects, and 200 Gbps channels are among the solutions defining AI system architectures.

Given those realities, several system architects ponder if PCIe 7.0 technology 128 GT/s raw bit rate is fast enough.

That seems fair, given GPU-to-GPU and GPU-to-CPU bridging protocols reach beyond 200 Gbps already. Many wonder if PCIe 7.0 can keep up as an alternative to GPU-to-XPU interconnects.

But is that a fair a question to ask?

Frankly, equating PCIe 7.0 technology with GPU-to-XPU interconnects is not an apples with apples comparison. Think about the use

cases.

PCI Express (and its predecessor PCI) have historically linked x86 CPUs with a multitude of I/Os in general compute applications – desktops, laptops, workstation, servers and more. Examples of general compute I/Os may include graphics cards, storage devices, network adaptors, or even AI accelerators.

PCI-SIG, the consortium that owns and manages PCI specifications as open industry standards, consistently works with member companies to double PCIe specification performance every three years. With the planned delivery of the PCIe 7.0 spec in 2025, they are right on schedule.

GPU-to-XPU interconnects were designed to enable high-speed, point-to-point GPU-to-GPU communications. In the earliest versions of accelerated computing, system architectures may have included one GPU for every CPU. Oversimplified, this is a 1 CPU:1 GPU architecture.

As AI models have grown, a 1 CPU:n GPU architectures have quickly emerged. With LLMs and other models having trillions of parameters, thousands of GPUs need to be ‘clustered’ to handle the necessary parallel computing. Faster and faster GPU-to-XPU interconnects have been the result. 200 Gbps GPU-to-XPU interconnects are currently the standard.

So, what’s the end result? Is PCIe 7.0 technology too fast or is it DOA? It depends on who you ask. In this writer’s opinion, PCIe 7.0 technology will complement GPU-to-XPU interconnects for the I/O use cases transferable between general compute, accelerated compute, and ever-evolving AI system topologies.

The short answer is PCIe 7.0-capable technology is real and ready for prototype implementation. Recently, at ECOC and again at OCP, Alphawave Semi and Samtec demonstrated 128 Gbps PAM4 system interoperability. The setup combined Alphawave Semi’s IP with Samtec’s high-performance interconnects.

The Alphawave Semi PipeCORE PCI-Express PHY transmits 128 GT/s data to a 2,5+ metre transmission line consisting of various Samtec high-performance interconnect systems. Despite the 2,5+ metre overall length and eight connection points, the system still achieves an excellent pre-FEC BER of e-10 or better.

So, is PCIe 7.0  technology coming too soon? Is it fast enough? I believe that PCIe 7.0 technology is the right solution for the right time.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

4 mm pitch power connectors
Spectrum Concepts Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.

Read more...
The effect of seasonal changes on ESD performance in South Africa
Actum Editor's Choice Circuit & System Protection Manufacturing / Production Technology, Hardware & Services
Electrostatic discharge performance is influenced by several environmental factors, with relative humidity being one of the most important. This is particularly relevant in South Africa, where seasonal changes can result in significant differences in humidity levels.

Read more...
Compact RTK design: More than just the receiver
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.

Read more...
The signal-to-noise challenge in large-scale IIoT
Sigfox South Africa Editor's Choice Telecoms, Datacoms, Wireless, IoT
For much of the last decade, the industrial IoT industry has been driven by a relatively simple assumption: if a little data is useful, more data must be better. That thinking shaped countless deployments.

Read more...
Women building South Africa’s power infrastructure
Editor's Choice
As South Africa celebrates Women’s Month in August, women are increasingly taking their place on the factory floor, in technical workshops and across engineering environments, helping manufacture the infrastructure that keeps the country’s electricity network running.

Read more...
More efficient production with optimised procurement
Editor's Choice
The smallest part on the BOM is usually the one that holds it up. Interconnect, passive and electromechanical components rarely get attention until they are missing. That is starting to change, and it is reshaping how procurement teams think about risk.

Read more...
Locate underground cable faults faster with the Fluke AF2082 A-Frame
Comtest Editor's Choice Test & Measurement
Underground cable faults can lead to costly downtime, service disruptions, and extensive excavation if the fault location is uncertain. The AF2082 simplifies this process by guiding operators directly to the fault point.

Read more...
Here is what we learnt from three supply chain crises
Seven Labs Technology Editor's Choice
Component crises are not random events. They follow a pattern. After fifteen years and three major disruptions, Seven Labs knows exactly what that pattern demands, and what it takes to keep production lines moving.

Read more...
The new reality of PCB material supply
Jemstech Editor's Choice Manufacturing / Production Technology, Hardware & Services
How resilient manufacturing strategies are helping OEMs navigate a changing global supply chain.

Read more...
Strengthening local electronics manufacturing through investment and innovation
Microtronix Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Microtronix South Africa cements its commitment to local manufacturing with ongoing investments in production capacity, skills development, and job creation.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved