Editor's Choice


PCIe 7.0 technology. Too soon or not fast enough?

29 November 2024 Editor's Choice

Many technologists seem to agree on one thing: innovation has never been faster. Why?

AI. The race is on to offer differentiated hardware solutions for optimised AI performance at the edge and in the data centre.

Data scientists, AI system architects, IC designers, optical engineers, interconnect providers like Samtec, and other solutions providers, are rethinking system topologies. GPU clustering, disaggregated computing, cache-coherent memory, optical interconnects, and 200 Gbps channels are among the solutions defining AI system architectures.

Given those realities, several system architects ponder if PCIe 7.0 technology 128 GT/s raw bit rate is fast enough.

That seems fair, given GPU-to-GPU and GPU-to-CPU bridging protocols reach beyond 200 Gbps already. Many wonder if PCIe 7.0 can keep up as an alternative to GPU-to-XPU interconnects.

But is that a fair a question to ask?

Frankly, equating PCIe 7.0 technology with GPU-to-XPU interconnects is not an apples with apples comparison. Think about the use

cases.

PCI Express (and its predecessor PCI) have historically linked x86 CPUs with a multitude of I/Os in general compute applications – desktops, laptops, workstation, servers and more. Examples of general compute I/Os may include graphics cards, storage devices, network adaptors, or even AI accelerators.

PCI-SIG, the consortium that owns and manages PCI specifications as open industry standards, consistently works with member companies to double PCIe specification performance every three years. With the planned delivery of the PCIe 7.0 spec in 2025, they are right on schedule.

GPU-to-XPU interconnects were designed to enable high-speed, point-to-point GPU-to-GPU communications. In the earliest versions of accelerated computing, system architectures may have included one GPU for every CPU. Oversimplified, this is a 1 CPU:1 GPU architecture.

As AI models have grown, a 1 CPU:n GPU architectures have quickly emerged. With LLMs and other models having trillions of parameters, thousands of GPUs need to be ‘clustered’ to handle the necessary parallel computing. Faster and faster GPU-to-XPU interconnects have been the result. 200 Gbps GPU-to-XPU interconnects are currently the standard.

So, what’s the end result? Is PCIe 7.0 technology too fast or is it DOA? It depends on who you ask. In this writer’s opinion, PCIe 7.0 technology will complement GPU-to-XPU interconnects for the I/O use cases transferable between general compute, accelerated compute, and ever-evolving AI system topologies.

The short answer is PCIe 7.0-capable technology is real and ready for prototype implementation. Recently, at ECOC and again at OCP, Alphawave Semi and Samtec demonstrated 128 Gbps PAM4 system interoperability. The setup combined Alphawave Semi’s IP with Samtec’s high-performance interconnects.

The Alphawave Semi PipeCORE PCI-Express PHY transmits 128 GT/s data to a 2,5+ metre transmission line consisting of various Samtec high-performance interconnect systems. Despite the 2,5+ metre overall length and eight connection points, the system still achieves an excellent pre-FEC BER of e-10 or better.

So, is PCIe 7.0  technology coming too soon? Is it fast enough? I believe that PCIe 7.0 technology is the right solution for the right time.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Omniball through-hole contacts
Spectrum Concepts Interconnection
Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.

Read more...
Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption
iCorp Technologies Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.

Read more...
SDRs – Which RF architecture should you choose?
RFiber Solutions Editor's Choice Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.

Read more...
Surviving the extremes: Understanding shock and vibration in MEMS sensors
Altron Arrow Editor's Choice Test & Measurement
By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.

Read more...
A two-stage approach to super-wide input voltage range DC-DC converters
RFiber Solutions Editor's Choice
Teaser: In addition to handling the various input voltage ranges required, the SynQor line of InQor DC-DC converters are fully encased and ruggedised to handle the harsh environments that often accompany systems that have such challenging technical requirements.

Read more...
From the editor's desk: Engineering the future
Technews Publishing Editor's Choice
As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.

Read more...
Barracuda commissions new IPC Class 3 aerospace facility
Barracuda Holdings Editor's Choice News
The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
From the editor's desk: Could X-ray lithography disrupt the economics of advanced chip manufacturing?
Technews Publishing Editor's Choice
Advanced semiconductor manufacturing has reached a point where technical progress is increasingly constrained by economic reality, and the proposed use of X-ray lithography represents a bold attempt to reset these economics.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved