DSP, Micros & Memory


Latest Articles

Accelerate development of physical AI deployments
31 July 2026, Altron Arrow
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

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AI-ready edge MPU for HMIs
31 July 2026, Future Electronics
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

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Industrial-grade ESP32-S3 controller
31 July 2026
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

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Universal NFC device
31 July 2026, Altron Arrow
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

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Compact low-power 32-bit platform
31 July 2026, EBV Electrolink
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

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Bridging the gap between prototype and production
31 July 2026
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

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Low-power memory born for edge AI
31 July 2026, iCorp Technologies
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

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Compact direct Time-of-Flight 3D LiDAR module
31 July 2026, Altron Arrow, AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

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Next-gen smart module powers intelligence at the edge
31 July 2026, iCorp Technologies
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

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Programmable logic redefined
29 June 2026
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.

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Compact MCU for IoT endpoints
29 June 2026, iCorp Technologies
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.

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Industrial-grade ESP32-S3 controller
29 June 2026
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

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Next-gen smart module powers intelligence at the edge
29 June 2026, iCorp Technologies
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

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Advanced sensing powers modern drones
29 June 2026, Future Electronics
Allegro MicroSystems has a portfolio of sensors, motor drivers, and power management devices specifically designed to enhance drone efficiency, reliability, and control.

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Addressing latency and signal integrity challenges
29 June 2026, Altron Arrow
Strengthening Microchip Technology’s data centre solutions portfolio, its XpressConnect retimers support high-bandwidth architectures, while helping reduce integration complexity.

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ESP32-S31 for advanced IoT
29 May 2026, iCorp Technologies
At the heart of the device is a dual-core 32-bit RISC-V MCU operating at up to 320 MHz, delivering 6,86 CoreMark/MHz performance with MMU support for efficient memory management.

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Cortex-M33 performance for cost-sensitive designs
29 May 2026, Future Electronics
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.

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Memory shortage 2026: Engineering implications for South Africa
28 April 2026
[Sponsored] Addressing this challenge requires system-level thinking and adoption with McKinsey Electronics providing the engineering and sourcing framework required to maintain system resilience despite ongoing global constraints.

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Cost-effective microcontroller series
28 April 2026, Altron Arrow
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.

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Battery-friendly Thread and BLE solution
28 April 2026, iCorp Technologies
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.

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