Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.
Measuring just 33 x 39 x 3,85 mm, the SG882G combines a compact form factor with powerful performance, seamlessly executing edge computing algorithms. Its high processing capability makes it ideal for space-constrained applications that demand efficient, real-time data processing.
Powered by the advanced QCS8550 IoT chipset from Qualcomm and featuring a Kryo CPU, the SG882G is engineered to support high-performance applications requiring edge computing and real-time multimedia streaming. The module also features an Adreno 740 GPU and a 48 TOPS NPU, providing exceptional computing performance for complex workloads. A Spectra ISP, Adreno 8550 VPU, and Adreno 1295 DPU are also integrated, making it ideal for applications that demand advanced image processing, video encoding/decoding, and real-time AI capabilities.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Simplifying RS485 network design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Aipu Power has added the RS485-XXXSAV to its transceiver module range, a single-channel isolated RS485 transceiver that bundles power isolation, signal isolation, RS485 interface and bus protection into one drop-in module, aimed at simplifying RS485 network design in industrial equipment.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...SGMICRO expands analogue IC portfolio iCorp Technologies
Passive Components Telecoms, Datacoms, Wireless, IoT
SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
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