Manufacturing / Production Technology, Hardware & Services


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Outscale your competition
EMP 2026 Electronics Manufacturing & Production Handbook
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

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MTN SA Foundation drives youth pathways into the digital economy
EMP 2026 Electronics Manufacturing & Production Handbook
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

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Downstream demand, system reliability, and the expanding role of engineering-led distribution
EMP 2026 Electronics Manufacturing & Production Handbook
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

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The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
EMP 2026 Electronics Manufacturing & Production Handbook, Testerion, Editor's Choice
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

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Understanding solder dross: causes and control strategies
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing, Editor's Choice
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

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Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

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Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

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The causes of solder balls in robotic soldering
EMP 2026 Electronics Manufacturing & Production Handbook
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

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Material challenges for superconducting quantum chips
EMP 2026 Electronics Manufacturing & Production Handbook
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

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UV curing oven for high-efficiency PCB production
EMP 2026 Electronics Manufacturing & Production Handbook, Techmet
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.

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Automatic stencil cleaning
EMP 2026 Electronics Manufacturing & Production Handbook, ZETECH ONE
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.

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Versatile wave soldering
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
The EMST Stallion fc - PLC is a highly capable wave soldering machine engineered for precision and productivity in electronics manufacturing.

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Robot series enhances repetitive production applications
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
The Robots 9494 Series from Quick-Global are versatile automation solutions designed to enhance industrial workflows where precision and repeatability are key.

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Precision PCB cleaning system
EMP 2026 Electronics Manufacturing & Production Handbook, Electronic Industry Supplies
The PBT Works HyperSWASH III is a top-tier automatic PCB cleaning system engineered for precision, high throughput, and advanced process control in modern SMT production.

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High-performance stencil printer
EMP 2026 Electronics Manufacturing & Production Handbook, Priben
The DEK NeoHorizon printer is a flexible, high-performance solder paste stencil printer engineered for modern SMT production.

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PCB graphical repair system
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
The GRS550 from Polar is a flying probe PCB repair system, designed to assist in repair and recovery of expensive boards with hard-to-find faults.

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Next-generation jet printing
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.

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Yamaha Motor releases YRH10W Hybrid Placer
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing
This model is based on the YRH10 and is compatible with 12-inch wafers and capable of transporting large PCBs.

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Efficiency and consistency in vapour phase soldering
EMP 2026 Electronics Manufacturing & Production Handbook, MyKay Tronics
The ASSCON VP1000-1080 and VP1000-1580 vapour phase soldering systems redefine large-format assembly production with precision, reliability, and ease of use.

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