Editor's Choice


Latest Articles

Engineering in a world that cannot assume connectivity
30 March 2026, Technews Publishing, News
Across industrial automation, networking, and defence systems, engineers are rediscovering the importance of resilience and autonomy in an increasingly connected world.

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Designing IoT devices for deterministic LPWAN environments
30 March 2026, Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.

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Driving excellence in electronics manufacturing
30 March 2026, Jemstech, Manufacturing / Production Technology, Hardware & Services
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.

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In sync with the line
30 March 2026, Testerion, Manufacturing / Production Technology, Hardware & Services
In modern SMT lines, stencil printing must meet two requirements at the same time: it has to ensure a reproducible solder paste volume, while adhering to the specified line cycle time.

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Resilient navigation in warfare: The role of non-GNSS
30 March 2026, Etion Create
Alternative navigation methods are essential for maintaining operational capability when satellite signals are unreliable or unavailable.

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Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption
28 February 2026, iCorp Technologies, Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.

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SDRs – Which RF architecture should you choose?
28 February 2026, RFiber Solutions, Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.

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Surviving the extremes: Understanding shock and vibration in MEMS sensors
28 February 2026, Altron Arrow, Test & Measurement
By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.

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A two-stage approach to super-wide input voltage range DC-DC converters
28 February 2026, RFiber Solutions
Teaser: In addition to handling the various input voltage ranges required, the SynQor line of InQor DC-DC converters are fully encased and ruggedised to handle the harsh environments that often accompany systems that have such challenging technical requirements.

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From the editor's desk: Engineering the future
28 February 2026, Technews Publishing
As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.

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Barracuda commissions new IPC Class 3 aerospace facility
EMP 2026 Electronics Manufacturing & Production Handbook, Barracuda Holdings, News
The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.

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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
EMP 2026 Electronics Manufacturing & Production Handbook, Testerion, Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

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Understanding solder dross: causes and control strategies
EMP 2026 Electronics Manufacturing & Production Handbook, Truth Electronic Manufacturing, Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

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From the editor's desk: Could X-ray lithography disrupt the economics of advanced chip manufacturing?
EMP 2026 Electronics Manufacturing & Production Handbook, Technews Publishing
Advanced semiconductor manufacturing has reached a point where technical progress is increasingly constrained by economic reality, and the proposed use of X-ray lithography represents a bold attempt to reset these economics.

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Could the EU’s Cyber Resilience Act affect your electronics manufacturing business?
27 November 2025, Altron Arrow
South African companies exporting IoT devices to the European Union face a significant regulatory shift with the Cyber Resilience Act becoming mandatory in December 2027.

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From the editor's desk: Resilience and innovation in South Africa’s electronics sector
27 November 2025, Technews Publishing
For South Africa in particular, 2025 has been a year that highlighted the resilience and adaptability of our engineering community as we navigated shifting technologies and a fast-moving international landscape

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Powering the future of embedded control
27 November 2025, Altron Arrow, DSP, Micros & Memory
As the demand for intelligent, connected, and energy-efficient systems grows, embedded engineers are under pressure to design faster, smarter, and more secure products

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Is it time for Wi-Fi 7 in SA?
27 November 2025, Technews Publishing, Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7, the IEEE 802.11be standard also known as Extremely High Throughput, is the next-gen wireless networking standard designed to dramatically improve speed, latency, efficiency, and reliability.

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20 years of precision, progress and purpose – the Jemstech journey
31 October 2025, Jemstech, Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.

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A new era in wire bond inspection
31 October 2025, Techmet , Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.

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