Quectel Wireless Solutions has announced the launch of the SG865W-WF, a new generation of flagship Android smart module. The module is equipped with Qualcomm’s QCS8250 system-on-chip (SoC), which offers powerful performance and rich multimedia functions to cater for industrial and consumer artificial intelligence IoT (AIoT) scenarios where high computing power is required.
The SG865W-WF has a built-in 8-core, high-performance Kryo 585 CPU, Adreno 650 GPU, Adreno 995 DPU, Adreno 665 VPU, Hexagon DSP and Spectra 480 ISP. The module supports Wi-Fi 6, Bluetooth 5.1 and 2x2 Wi-Fi MIMO technology. A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C and SPI) allow the module to serve a wide range of M2M applications, including video conferencing systems, live streaming devices, gaming, edge computing, AR/VR, intelligent retail and security systems. With the high degree of computing power available, the module is also capable of accelerating the deployment of high-end AIoT applications such as unmanned aerial vehicles and robots.
With AIoT becoming a new trend in IoT development, many devices not only need to achieve connections through the various wireless networks, they also require real-time analysis of the massive amount of data that is generated, in order to realise local decision-making and response capabilities. The SG865W-WF module can provide an optimal solution to the industry’s AIoT needs.
Module for smart city and smart utility devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...Wi-Fi in 2025: When is Wi-Fi 7 the answer? iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.
Read more...High-accuracy positioning iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has recently announced its LG580P, a multi-constellation, multi-band GNSS module designed for high-precision positioning that supports multi-band signals across L1, L2, L5, and L6.
Read more...The world’s first RISC-V MCU to achieve PSA-L2 iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-C6 is the world’s first RISC-V MCU to achieve PSA-L2 security certification, security certification, underscoring the company’s commitment to delivering robust, secure, and reliable IoT solutions.
Read more...Power inductors iCorp Technologies
Passive Components
he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
Read more...Eskom announces PV registration extension
Computer/Embedded Technology
The South African Photovoltaic Industry Association has welcomed Eskom’s decision to extend its zero-registration fee policy and free smart meter installation for residential Small-Scale Embedded Generation customers until March 2026.
Read more...Connectivity for industrial applications iCorp Technologies
DSP, Micros & Memory
Quectel has introduced the SG882G, its latest flagship Android/Linux smart module, designed to deliver exceptional computing power, multimedia capabilities, and seamless connectivity for industrial and consumer applications.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version