Quectel Wireless Solutions has announced the launch of the SG865W-WF, a new generation of flagship Android smart module. The module is equipped with Qualcomm’s QCS8250 system-on-chip (SoC), which offers powerful performance and rich multimedia functions to cater for industrial and consumer artificial intelligence IoT (AIoT) scenarios where high computing power is required.
The SG865W-WF has a built-in 8-core, high-performance Kryo 585 CPU, Adreno 650 GPU, Adreno 995 DPU, Adreno 665 VPU, Hexagon DSP and Spectra 480 ISP. The module supports Wi-Fi 6, Bluetooth 5.1 and 2x2 Wi-Fi MIMO technology. A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C and SPI) allow the module to serve a wide range of M2M applications, including video conferencing systems, live streaming devices, gaming, edge computing, AR/VR, intelligent retail and security systems. With the high degree of computing power available, the module is also capable of accelerating the deployment of high-end AIoT applications such as unmanned aerial vehicles and robots.
With AIoT becoming a new trend in IoT development, many devices not only need to achieve connections through the various wireless networks, they also require real-time analysis of the massive amount of data that is generated, in order to realise local decision-making and response capabilities. The SG865W-WF module can provide an optimal solution to the industry’s AIoT needs.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...From idea to intelligent product TRX Electronics
Computer/Embedded Technology
Mouser Electronics has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino UNO Q Helps Designers Go from Idea to Intelligent Product.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Think Diamond Long-life COM-based SBCs Electronic Products Design
Computer/Embedded Technology
A COM-based SBC combines the flexibility of a standard computer-on-module (COM) with a baseboard offering additional I/O, expansion sockets, power supplies, and I/O connectors. The result is a highly flexible, highly expandable, feature-dense product that can be adapted to the widest range of applications, offering maximum product lifetime.
Read more...Next-Gen Min-ITX motherboard Vepac Electronics
Computer/Embedded Technology
Adding to AAEON’s extensive industrial motherboard portfolio, the Next-Gen MIX-Q870A1 is the company’s most advanced Mini-ITX board to date.
Read more...Rev 2.0 PolarFire FPGA ethernet sensor bridge Altron Arrow
Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Simplifying RS485 network design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Aipu Power has added the RS485-XXXSAV to its transceiver module range, a single-channel isolated RS485 transceiver that bundles power isolation, signal isolation, RS485 interface and bus protection into one drop-in module, aimed at simplifying RS485 network design in industrial equipment.
Read more...SGMICRO expands analogue IC portfolio iCorp Technologies
Passive Components Telecoms, Datacoms, Wireless, IoT
SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version