Quectel Wireless Solutions has announced the launch of the SG560D, an Android smart module integrating 5G New Radio (NR) and artificial intelligence (AI) technologies. Featuring a powerful CPU and GPU, the SG560D will satisfy complex application scenarios that require both high data rates and computing capabilities such as in-vehicle infotainment, industrial handheld devices, smart gateways, industrial cameras and monitoring devices.
“In the era of Artificial Intelligence of Things (AIoT), computing capability becomes more critical to make devices smarter and more responsive. Our 5G SG560D module combines 5G and AI technologies to deliver state-of-the-art performance in communication and data processing,” said Patrick Qian, CEO of Quectel. “I believe the SG560D will offer an excellent option for edge computing requirements and will accelerate the digital transformation of devices.”
Powered by the Qualcomm QCM6490 chipset, Quectel’s SG560D is a 5G sub-6GHz smart module equipped with a Qualcomm Kryo 670 CPU as well as a Qualcomm Adreno 642L GPU, which together bring superior computing power to enable fast data processing. Tests indicate that the SG560D module can achieve computing performance of up to 14 trillion operations per second (TOPS).
Quectel’s SG560D contains an embedded Android 12 operating system and allows for future upgrades to the OS. It has a default onboard memory of 4 GB LPDDR4X + 64 GB UFS, with multiple memory configurations available. The product has multi-region variants including SG560D-EU for EMEA, SG560D-NA for North America, SG560D-CN for China and SG560D-WF for worldwide use.
Through the MIPI DSI interface, the SG560D can support displays with a maximum resolution of 2520 x 1080 and a refresh rate of 144 Hz. The module provides video performance offering a maximum 4K@30fps video encode and 4K@60fps video decode as well as a maximum of five groups of cameras.
Featuring 5G standalone (SA) and non-standalone (NSA) network architectures, the SG560D supports downlink 4x4 MIMO and uplink 2x2 MIMO. In addition to cellular communication capability, the SG560D supports Wi-Fi 6E bands of 2,4 GHz, 5 GHz and 6 GHz, Wi-Fi 2x2 MU-MIMO. and Bluetooth 5,2, which will significantly improve network coverage and enhance transmission data rates.
The module also contains a multi-constellation GNSS receiver and can concurrently receive signals from up to seven constellations (GPS/GLONASS/BDS/NavIC/Galileo/QZSS/SBAS). By combining GNSS signals from dual-frequency bands (L1/L5), the module can deliver fast and highly accurate positioning performance.
With various peripheral interfaces such as dual USB, multiple PCIe and UART, I2S and SPI, the SG560D offers flexibility and ease of integration to OEM developers in a wide range of AIoT applications including video conferencing systems, live streaming devices, gaming, edge computing, robots, drones, AR/VR and intelligent retail.
Battery-friendly Thread and BLE solution iCorp Technologies
DSP, Micros & Memory
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
Read more...DC-DC converters for next-generation IoT iCorp Technologies
Power Electronics / Power Management
AIPUPOWER’s K78XXJT-500R3 and K78XXJT-500R3-LB give designers a compact, high-efficiency power option for battery-powered and space-constrained systems, combining up to 96% efficiency with no-load input current as low as 0,2 mA.
Read more...Compact edge platform for AI iCorp Technologies
AI & ML
Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
Read more...Reliable isolation for modern networks ASIC Design Services
Computer/Embedded Technology
The Pro-Tek5 PTI Series delivers reinforced 5 kV Ethernet isolation for applications that demand robust protection, reliable signal integrity, and full IEEE802.3 performance.
Read more...Low-power SoC for IoT designs iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
Read more...NVDC power-path control to 1– 6 cell battery systems iCorp Technologies
Power Electronics / Power Management
SG Micro’s SGM41581 is an I2C-controlled narrow voltage direct charging buck boost charge controller designed to simplify robust power delivery in systems that must seamlessly operate from an adapter input or a battery pack.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Lower-power Thread and BLE connectivity iCorp Technologies
DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
Read more...Next-gen modules for rugged edge AI systems Altron Arrow
Computer/Embedded Technology
Designed for real-world edge deployments where systems do not sit still, SolidRun’s P100 COMx6 series targets mobile platforms as well as harsh, mission-critical environments.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version