Manufacturing / Production Technology, Hardware & Services


5G technology fuels connectivity and innovation

23 November 2022 Manufacturing / Production Technology, Hardware & Services

For years, we’ve been hearing: “5G is coming and it’s going to transform our world!” Is this realistic or is it just hype? According to Mycronic experts, this is certainly not hype. New 5G technology, with up to 100 times faster speeds than today’s 4G, will open exciting new possibilities for consumers and businesses, but it is already placing tough demands on manufacturers.

“Right now, we’re seeing the first waves of 5G devices hitting the market,” says Ivan Li, Sr VP of Mycronic’s assembly solutions high volume division. “These devices use a high-band spectrum that offers faster connectivity, ultra-low latency and the ability to handle a lot more data.”

5G investments are accelerating

Li explains that latency is the lag time in the transmission that can disrupt the user experience – whether it’s for advanced gaming, streaming of videos, e-health, or connected vehicles. Now, with greater transmission speeds, 5G networks will dramatically enhance the experience by reducing that lag. And while the rollout of 5G mobile networks has been slightly delayed due to the recent global pandemic, the ramp-up in investments is accelerating.

“In my view, 5G is the technology leap that will form the backbone for future technology innovation, including the 3D Metaverse. It’s real and it’s happening now!” Li says.

High-volume dispensing and protective coatings

From his front-row position in the electronics hub of Shenzhen, China, Li and his team are in a unique position to see the manufacturing challenges of 5G playing out in real time.

“For consumer electronics, the challenge is to create robust, well-protected smartphones, wearables, and devices. Here is where Mycronic’s fully automated high-volume dispensing and protective coating equipment is being widely adopted by leading manufacturers,” he says.

“But this is not all,” says Li. “Suppliers of infrastructure like 5G radio base stations, switches and routers must also be able to mount layers of advanced components on complex printed circuit boards. This may require full-line SMT solutions, including jet printers and specially tailored dispensing solutions.”

Die bonding and electrical PCB testing

Finally, he notes that Mycronic’s Global Technologies division is developing crucial die bonding solutions for 5G network components, and electrical tests for the bare board PCBs used.

“5G rollout across the globe continues to demand that manufacturers produce increasingly smaller products, with higher speed and bandwidth,” says Li. “The 5G technology requires high-performance optical devices, such as transceivers embedded in datacentres, to allow data to flow in and out at maximum speeds.”

To be able to handle miniaturisation with accuracy and speed, Li points to exciting new developments at Mycronic’s MRSI unit (part of Global Technologies division), which provides cutting-edge die bonding equipment for customers manufacturing such optical devices. “MRSI’s die bonders help them overcome significant challenges to deliver increasingly smaller packaging housing with smaller dies and higher density,” he concludes.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Revolutionising clean air in electronics manufacturing
Allan McKinnon & Associates Manufacturing / Production Technology, Hardware & Services
Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.

Read more...
High-speed multi-function dispensing
Techmet Manufacturing / Production Technology, Hardware & Services
The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.

Read more...
Optical inspection for SMT
Techmet Manufacturing / Production Technology, Hardware & Services
The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.

Read more...
Yamaha introduces upgrades to its 3D AOI systems
Truth Electronic Manufacturing Manufacturing / Production Technology, Hardware & Services
Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.

Read more...
Flexible printed electronics substrates
Manufacturing / Production Technology, Hardware & Services
New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.

Read more...
Lead-free solder paste
Techmet Manufacturing / Production Technology, Hardware & Services
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.

Read more...
Analog Devices and Mouser collaborate on eBook
Manufacturing / Production Technology, Hardware & Services
Mouser has released a new eBook in collaboration with Analog Devices, that offers a detailed analysis of the technologies being used to support sustainable manufacturing practices.

Read more...
Improved precision laser marking
RS South Africa Manufacturing / Production Technology, Hardware & Services
On-the-fly marking at high speeds is only one of the comprehensive features of Panasonic’s new LP-RH laser marker series.

Read more...
Optimising AOI performance
Rugged Interconnect Technologies Manufacturing / Production Technology, Hardware & Services
Optimising AOI performance is now a reality with the highly integrated ADLINK MVP-6200, combined with Intel Arc GPUs.

Read more...
High-mix SMT solution from Panasonic
Techmet Manufacturing / Production Technology, Hardware & Services
Only one machine is required to get production started, and adding more units and/or technologies as demand changes is easy to accomplish.

Read more...