Wireless connectivity has become a mandatory feature for many products, but often increases the cost and complexity of system design since it generally must be added as part of the larger application. Microchip Technology has introduced its first Arm Cortex-M4F-based PIC microcontroller family that solves this wireless connectivity design challenge. It accomplishes this by integrating Bluetooth Low Energy functionality directly into one of a system’s most basic components.
“Our PIC32CX-BZ2 MCU family removes barriers that have made it difficult to bring wireless applications to market, from availability problems and complexity challenges to regulatory certification hurdles and long-term support concerns,” said Steve Caldwell, vice president of Microchip’s wireless solutions business unit. “Our family tightly integrates wireless connectivity with an MCU that is built on our decades of specialised experience and backed by a vertical manufacturing approach that encompasses ICs, Microchip’s highly integrated software stacks, in-house module manufacturing and a customer-driven obsolescence practice.”
Microchip’s PIC32CX-BZ2 family includes system-on-chip (SoC) devices as well as global regulatory-certified, RF-ready modules. In addition to Bluetooth Low Energy functionality, the family includes Zigbee stacks and over-the-air (OTA) update capabilities.
The MCU family hardware features include a 12-bit analog to digital converter, multiple timer/counters channels, an on-board encryption engine, and a broad set of interfaces for touch, CAN, sensor, display and other peripherals. The family’s 1 MB of Flash memory supports large application codes, multiprotocol wireless stacks, and OTA updates.
AEC-Q100 Grade 1 qualified packages provide an operating temperature up to 125°C and further simplify wireless connectivity integration where highly robust solutions are required.
MCU for noisy environments EBV Electrolink
DSP, Micros & Memory
The MCX?E24X is a high-performance microcontroller family from NXP, engineered for industrial, automotive-like, and energy-focused environments.
Read more...SmartRAID 4300 Series Altron Arrow
DSP, Micros & Memory
Microchip’s disaggregated architecture leverages host CPU and PCIe infrastructure to overcome traditional storage bottlenecks in scalable, secure NVMe RAID storage solutions.
Read more...High-performance SDR range RFiber Solutions
DSP, Micros & Memory
Epiq Solutions offers high-performance RF tuners and software-defined radios with various specifications for diverse applications in congested environments.
Read more...Multi-config connector series Future Electronics
Interconnection
Hirose Electric’s DF11 Series is a versatile 2,0 mm pitch, double-row board-to-wire connector designed to simplify a wide range of connection needs.
Read more...High performance SDR design considerations RFiber Solutions
Editor's Choice DSP, Micros & Memory
As the spectrum gets increasingly crowded, and adversaries more capable, the task of examining wide bands and making sense of it all, while not missing anything, gets harder.
Read more...Direct RF converters and FPGAs boost EW applications RFiber Solutions
DSP, Micros & Memory
The latest boost to electronic warfare designs comes from emerging FPGA architectures that combine advanced RF converters and high-performance processing engines in a single package.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
Read more...New SiC power MOSFET Future Electronics
Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.
Read more...Satellite IoT through non-terrestrial networks Future Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Non-terrestrial networks fill cellular coverage gaps in remote areas by extending terrestrial networks and are not subject to disruptions from natural disasters or sabotage.
Read more...1D Time-of-Flight sensor Future Electronics
Telecoms, Datacoms, Wireless, IoT
ams OSRAM has introduced its TMF8806, a 1D Time-of-Flight sensor that has been developed to remove the barriers of previous single-zone dToF devices.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version