26 April 2023Editor's Choice
Telecoms, Datacoms, Wireless, IoT
The L89 R2.0 from Quectel is a dual-band, multi-constellation GNSS module. It features a GNSS chipset engine that supports concurrent reception of four GNSS constellations (GPS L1 C/A, Galileo E1, QZSS L1 C/A, and NAvIC L5) by default. It is pin-compatible with Quectel L89 NAvIC-enabled GNSS module.
Compared with GNSS modules that track only GPS, GLONASS, or BDS signals, L89 R2.0 can receive and track more visible satellites, thereby significantly mitigating the multipath effect in deep urban canyons, reducing signal acquisition times, and improving positioning accuracy.
With integrated LNAs and SAW filters, the module achieves higher sensitivity and increased anti-interference capability. Antenna detection and antenna short-circuit protection functions are built directly into the module.
L89 R2.0 supports advanced power management, enabling low-power GNSS sensing and position fix, which makes the module an ideal solution for power-sensitive and battery-powered systems.
The module supports both UART and I2C digital communication interfaces. Fast TTFF is implemented through the integrated augmented (A)GNSS system. The L89 R2.0 is perfectly suited for applications such as real-time tracking systems.
Engineering in a world that cannot assume connectivity Technews Publishing
Editor's Choice News
Across industrial automation, networking, and defence systems, engineers are rediscovering the importance of resilience and autonomy in an increasingly connected world.
Read more...NVDC power-path control to 1– 6 cell battery systems iCorp Technologies
Power Electronics / Power Management
SG Micro’s SGM41581 is an I2C-controlled narrow voltage direct charging buck boost charge controller designed to simplify robust power delivery in systems that must seamlessly operate from an adapter input or a battery pack.
Read more...Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Driving excellence in electronics manufacturing Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Jemstech’s reputation for disciplined execution and client-focused service has earned it strong loyalty from companies operating in demanding industries.
Read more...Lower-power Thread and BLE connectivity iCorp Technologies
DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
Read more...In sync with the line Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
In modern SMT lines, stencil printing must meet two requirements at the same time: it has to ensure a reproducible solder paste volume, while adhering to the specified line cycle time.
Read more...Enabling the next generation of high-performance wireless designs iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.