Yamaha Robotics SMT Section has revealed its latest inline solder-paste inspection system, the VP-01G-Y, with advanced features to raise surface-mount production quality and productivity.
Consolidating high-speed and high-resolution inspection capabilities in a single unit, the VP-01G-Y uses advanced algorithms in 2D and 3D modes to aid focusing and contour extraction. Analysis includes 3D solder-paste and adhesive inspection, foreign-matter detection, and board warpage, to assist screen-printing, dispensing, and component-placement processes. The system compensates for board warping and handles inspection of flexible PCBs.
Advanced features include a ring light source that provides 360° illumination to ensure reliable inspection and accurate three-dimensional measurements.
The one-head design allows continuous, changeover-free inspection, with 25, 20, or 15 µm lens and software-controlled multiple-resolution switching for additional settings. The resolution is switchable for each visual field, enabling optimum throughput when inspecting boards with areas of high interconnect density.
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