Espressif Systems announced its latest SoC, the ESP32-P4. It is powered by a RISC-V CPU, with an AI instructions extension, an advanced memory subsystem, and integrated high-speed peripherals.
Powered by a dual-core RISC-V CPU running up to 400 MHz, ESP32-P4 also supports single-precision FPU and AI extensions. The SoC also integrates an LP-Core, which can run up to 40 MHz. This is critical in terms of supporting ultra-low-power applications where the high-performance (HP) cores can be kept off for most of the time, saving power.
The ESP32-P4 HP core system has 768 kB of on-chip SRAM while the HP core system has 8 kB of zero-wait TCM RAM, which can be used for fast data buffers or time-critical sections of code. The SoC has more than 50 programmable GPIOs, and it supports all the commonly used peripherals, such as SPI, I2S, I2C, PWM, RMT, ADC, DAC, and UART. The chip also supports USB OTG 2.0 HS, Ethernet, and SDIO Host 3.0 for high-speed connectivity.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Simplifying RS485 network design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Aipu Power has added the RS485-XXXSAV to its transceiver module range, a single-channel isolated RS485 transceiver that bundles power isolation, signal isolation, RS485 interface and bus protection into one drop-in module, aimed at simplifying RS485 network design in industrial equipment.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...SGMICRO expands analogue IC portfolio iCorp Technologies
Passive Components Telecoms, Datacoms, Wireless, IoT
SGMICRO continues to add to its analogue IC portfolio at a steady pace, with new devices released across power protection, power conversion, current sensing and RF signal-chain categories.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version