Mouser Electronics is now shipping the new Digi ConnectCore MP255 development kit, which boasts a versatile, secure, and cost-effective wireless system-on-module (SoM), designed for maximum power efficiency to support battery-powered and industrial AI applications.
The Digi ConnectCore MP255 development kit features a robust STMicroelectronics STM32MP255C 64-bit microprocessor, tailored for industrial settings, with a neural processing unit (NPU) and image signal processor (ISP) for edge AI and computer vision applications and time-sensitive networking. It is available in a compact SMTplus form factor (30 x 30 mm), making it ideal for small portable devices and Industry 4.0 applications. The ConnectCore MP255 kit also delivers access to the STM32MP255C’s high-end graphics capabilities, such as an integrated 3D GPU, video encoder and decoder, high-resolution MIPI, LVDS or parallel display interfaces, and a MIPI camera port with an ISP, providing the flexibility to run AI applications on the CPU, GPU, or NPU.
The ConnectCore MP255 kit supports high-end edge computing applications like machine vision, leveraging multimedia capabilities made possible by the comprehensive ST Edge AI ecosystem. The SoM provides fully integrated wireless connectivity with pre-certified Wi-Fi 6 (tri-band 6E ready), 802.11ax and Bluetooth 5.4, along with PCIe Gen2, USB 3.0, CAN-FD and Gigabit Ethernet.
Tiny SoM integrates NXP i.MX 91
AI & ML
The QS91 module from Direct Insight utilises the low-cost single core i.MX 91 to deliver secure, energy-efficient Linux capabilities for edge applications.
Read more...Robotics platform powers intelligent systems Vepac Electronics
AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
Read more...SensorGPT speeds intelligent IoT deployment
AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
Read more...Ideal entry point into edge AI Avnet Silica
AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
Read more...Compact edge platform for AI iCorp Technologies
AI & ML
Built around the Qualcomm QCS6490 octa-core SoC, Quectel’s QuecPi Alpha delivers up to 12 TOPS of on-device AI performance.
Read more...Axon NPU powers smarter edge RF Design
AI & ML
The nRF54LM20B from Nordic Semiconductor is an ultra-low-power wireless SoC that combines advanced edge AI capabilities with robust radio connectivity and rich peripheral support.
Read more...FPGA platform designed for the edge
AI & ML
Sundance Multiprocessor Technology has introduced the SMT135-C, an Efinix Titanium Ti135 evaluation platform designed for edge computing, real-time control, and vision-centric workloads.
Read more...AI-controlled swarms: Algorithmic warfare Technews Publishing
AI & ML
The rapid proliferation of Unmanned Aerial Systems (UAS), ranging from hobbyist quadcopters to sophisticated munitions-carrying military drones, has fundamentally altered the security landscape and come to the fore with the current war in the Middle East.
Read more...Rugged AI PC for industry Vepac Electronics
AI & ML
Designed to operate where conventional systems fall short, the TB-7145-MVS compact industrial PC supports advanced machine inferencing, real-time data handling, and high-performance graphics workloads without compromise.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version