The ZelFlex patented stretching system uses compressed air to deliver precise, uniform tension across the entire stencil working area, ensuring optimal print performance from the outset. Once the stencil is positioned and tensioned on the frame, the air supply is disconnected. The frame can then be installed directly into the printer and operated continuously for up to 24 hours without any need to reconnect the air source.
This controlled pneumatic tensioning eliminates the long-term tension decay commonly associated with glued frames, resulting in improved production stability and consistently high print quality throughout extended runs. The system’s innovative perforation design allows for fast, easy, and repeatable stencil changes, significantly reducing downtime and operator effort.
One of the key advantages of ZelFlex pneumatic frames is their ability to maintain constant tension over time, delivering reliable and repeatable print results. By simply adjusting air pressure levels, the system can accommodate a wide range of stencil thicknesses. ZelFlex frames also reduce overall production costs, as a single frame can be used across multiple projects and production lines.
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version