MultiDimension Technology has announced the MIS63xx sensors for magnetic image scanning at high resolutions. They are designed for financial anti-counterfeit appliances in banknote sorters, ATM and vending machines, and are suited for non-destructive testing (NDT) applications.
The devices are designed with an array of TMR sensors with a spatial resolution of 50 dpi, along with high sensitivity and excellent noise immunity for retrieving the embedded magnetic image on banknotes.
In conjunction with this announcement, the company released the TMR6201, TMR6206 and TMR6218 as enhanced versions of its current offering of 1/6/18-channel banknote reader sensors, with higher sensitivity, improved noise immunity and competitive pricing. In addition, the TMR6201D and TMR6218D are new banknote reader sensors with digital outputs.
Next-gen Wi Fi 6E connectivity for embedded systems iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its connectivity portfolio with the introduction of the ESP32-E22, the company’s first Wi-Fi 6E connectivity co-processor.
Read more...Rugged railway-grade DC-DC power modules iCorp Technologies
Power Electronics / Power Management
iCorp Technologies has introduced the AIPUPOWER ZCD100 and ZCD150 Series, a family of rugged DC-DC converters designed to meet the demanding electrical and environmental requirements of railway and transportation systems.
Read more...Quectel redefines connectivity with RG660Qx 5G Series iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Purpose-built to meet the demands of next-generation IoT and wireless broadband, these modules leverage the cutting-edge Qualcomm X85 and X82 5G Modem-RF systems to deliver enterprise-grade performance.
Read more...Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.
Read more...Powering next-gen IoT connectivity iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Non-isolated, regulated DC-DC module iCorp Technologies
Power Electronics / Power Management
AIPUPOWER’s K7805M-3000 is a compact switching regulator module delivering a regulated 5 V output at up to 3 A, intended for common DC buses used in industrial and mobile platforms.
Read more...Quectel introduces tri-band MCU Wi-Fi 6E module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Supporting operation across the 2,4 GHz, 5 GHz, and 6 GHz bands, the FGMC63N delivers true tri-band capability in a compact, integrated design.
Read more...High-performance Wi-Fi and Bluetooth module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FCU741R is a high-performance Wi-Fi 4 module launched by Quectel, supporting 2,4 and 5 GHz frequencies which can be used for WLAN connection.
Read more...High-performance MCU with mesh communication iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KGM133S is a high-performance by Quectel that boasts an ARM Cortex-M33 processor with a frequency of up to 78 MHz, and Matter, Thread, Zigbee, BLE 6.0, and BLE mesh.
Read more...SBC with 12 TOPS computing power iCorp Technologies
Computer/Embedded Technology
The QSM560DR series is Quectel’s multi-mode 5G smart control panel with built-in Ubuntu/Android/Windows operating system based on the Quectel SG560D series smart module.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version