4 November 2015Manufacturing / Production Technology, Hardware & Services
Electrolube will use the pending productronica expo in Munich as a platform to showcase enhancements to two of its most successful thermal management products to provide superior properties across a greater range of applications.
TCORP – Thermally Conductive RTV Plus TCORP is a superior version of the company’s TCOR single-component, low-odour, room temperature vulcanisation (RTV) silicone, which cures upon exposure to atmospheric moisture (oxime-cure). The thermal conductivity of the new formulation has been increased from
1,8 W/m.K (TCOR) to 2,20 W/m.K (TCORP).
TCORP is ideal for gap filling around components and power resistors to dissipate excess heat via heatsinks, and is very effective at preventing overheating and premature component failures. It is a multi-use product, as it can be used both as a sealant or gasketing compound, as well as a low bond strength thermal adhesive.
TCORP has a wide operating temperature range (-50°C to +230°C), making it a suitable contender for harsh automotive under-hood applications. It is an ideal solution when thermal conductivity is a critical requirement for an application.
SCTP – Surface-Cure Thermal Paste
SCTP is a highly effective and efficient thermal interface material, designed to fill gaps that naturally exist between two metal surfaces placed one upon the other, dramatically improving the effective range of surface area for heat transfer.
One of the key properties of SCTP is that it does not set, remaining malleable when rework of components is required. The product is specifically designed to resist pump-out of the thermal interface layer from the bond line, ensuring minimal degradation of effective heat dissipation. It is especially suited to applications that are exposed to rapid and frequent changes in temperature, as such conditions are known to exaggerate the pump-out effect of standard thermal pastes. SCTP also has excellent thermal stability, resisting up to 200°C.
While the material can be applied using conventional industrial dispensing equipment, it can also be applied via screen/stencil printing directly onto the contact surfaces. In addition, SCTP does not contain any solvents and due to its ease of application, it is possible to apply very thin films, thus minimising the effects of thermal resistance at the interface and offering much greater stability over the lifetime of the device when compared to conventional heat transfer systems.
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