Telecoms, Datacoms, Wireless, IoT


Programmable Bluetooth LE chips

27 January 2016 Telecoms, Datacoms, Wireless, IoT

Cypress Semiconductor’s PSoC 4 BLE programmable system-on-chip and PRoC BLE programmable radio-on-chip solutions each now have an option for a micro-ball chip scale package (CSP) optimised to bring Bluetooth Smart connectivity to secure credit card applications. The package is only 0,38 mm thick, making the reliable and fully Bluetooth-certified solutions ideal to replace chip-on-board devices. Both solutions integrate a Bluetooth Smart radio, a high-performance 32-bit ARM Cortex-M0 core with ultra-low-power modes, up to 256 KB Flash memory, 36 GPIOs, and customisable serial communication blocks, timers and counters. Additionally, both solutions have an on-chip balun that simplifies antenna design while reducing board size and system cost.

Future Electronics, +27 (0)21 421 8292, marian.ledgerwood@futureelectronics.com, www.futureelectronics.com



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