Telecoms, Datacoms, Wireless, IoT


Programmable Bluetooth LE chips

27 January 2016 Telecoms, Datacoms, Wireless, IoT

Cypress Semiconductor’s PSoC 4 BLE programmable system-on-chip and PRoC BLE programmable radio-on-chip solutions each now have an option for a micro-ball chip scale package (CSP) optimised to bring Bluetooth Smart connectivity to secure credit card applications. The package is only 0,38 mm thick, making the reliable and fully Bluetooth-certified solutions ideal to replace chip-on-board devices. Both solutions integrate a Bluetooth Smart radio, a high-performance 32-bit ARM Cortex-M0 core with ultra-low-power modes, up to 256 KB Flash memory, 36 GPIOs, and customisable serial communication blocks, timers and counters. Additionally, both solutions have an on-chip balun that simplifies antenna design while reducing board size and system cost.

Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6/BLE module enables rapid development
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.

Read more...
Low phase noise amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.

Read more...
Webinar: Enabling the digital transformation of IIoT with Bluetooth
Telecoms, Datacoms, Wireless, IoT
Key industrial use cases for Bluetooth will be reviewed, including the main performance requirements for Bluetooth in industrial applications, and the technical features available.

Read more...
Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Bridging the gap between MCUs and MPUs
Future Electronics Editor's Choice AI & ML
The Renesas RA8 series microcontrollers feature Arm Helium technology, which boosts the performance of DSP functions and of AI and machine learning algorithms.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
Enhanced code protection for USB µC portfolio
Future Electronics DSP, Micros & Memory
To help easily incorporate USB power and communication functionality into embedded systems, Microchip Technology has launched the AVR DU family of microcontrollers.

Read more...