Alliance Memory introduced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8 Gb density in the 78-ball, 9 x 13,2 mm, lead-free FBGA package.
Delivering increased power efficiency for high-end computer and storage systems, the 1 G x 8 AS4C1G8MD3L offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800 MHz.
The chip’s transfer rates are twice as fast as DDR and DDR2 SDRAMs, providing higher bandwidth for newer-generation microprocessors in industrial, medical, networking, telecom and aerospace applications. The SDRAM operates from a single 1,35 V power supply and is backwards-compatible with 1,5 V power supplies to enable large memory subsystems. The device is a logical choice for customers that require increased memory yet face board space constraints.
The AS4C1G8MD3L is available with an extended commercial temperature range of 0°C to +95°C (AS4C1G8MD3L-12BCN). Internally configured as eight banks of 1 G x 8 bits, the device features a fast 64 ms, 8192-cycle refresh from 0°C to +85°C and 32 ms from +85°C to +95°C.
The SDRAM offers fully synchronous operation and provides programmable read or write burst lengths of 4 or 8. An auto precharge function provides a self-timed row precharge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, and a programmable mode register allows the system to choose the most suitable modes to maximise performance.
In addition to the 1 G x 8 AS4C1G8MD3L, Alliance Memory also offers the 512M x 16 AS4C512M16D3L in the 96-ball FBGA package, which is available in an extended commercial temperature range (AS4C512M16D3L-12BCN) and an industrial temperature range from -40°C to +95°C (AS4C512M16D3L-12BIN).
Alliance Memory is one of the few suppliers of monolithic DDR3L SDRAMs with high densities to 8 Gb. In addition, with minimal die shrinks, the single-die AS4C1G8MD3L provides a reliable drop-in, pin-for-pin-compatible replacement for a number of similar solutions – eliminating the need for costly redesigns and part requalification.
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