Infineon Technologies developed the new 700 V CoolMOS P7 family to serve today’s and tomorrow’s trends in quasi resonant flyback topologies.
These new MOSFETs offer performance improvements compared to currently used superjunction technologies, which can benefit soft switching topologies like smartphone and tablet chargers, and notebook adaptors. Additionally, the new CoolMOS supports fast switching and high power density designs for TV adaptors, lighting, audio and Aux power. The new family conveys an improved form factor for very slim designs.
Compared to competitor parts the new 700 V CoolMOS P7 technology delivers reduced switching losses from 27% up to 50%, while in a flyback based charger application the technology leads to up to 3,9% higher efficiency, according to Infineon. Furthermore, the device temperature is reduced by up to 16 K. In comparison to the previous 650 V C6 technology it offers a 2,4% gain in efficiency and 12 K lower device temperature.
The integrated Zener diode ensures an increased ESD ruggedness of up to HBM Class 2 level. Customers profit from an improved assembly yield which leads to less production-related failures and saves manufacturing costs.
Additionally, the 700 V CoolMOS P7 shows low losses due to its very low RDS(on)*Qg and RDS(on)*EOSS. Compared to C6 technology as well as to some competitor devices, the new family features an extra 50 V blocking voltage.
With ease of use in mind, the technology has been developed with a VGSth of 3 V and a very narrow tolerance of ±0,5 V. This makes the new P7 family very easy to design-in and enables the usage of lower gate source voltage, which makes it easier to drive and leads to less idle losses. Especially in price sensitive segments, the new devices offer an attractive price-performance ratio.
The 700 V CoolMOS P7 family is available with the most relevant RDS(on) package combinations including 360 mΩ up to 1400 mΩ in IPAK SL, DPAK and TO-220FP. Infineon says the RDS(on) range of this superjunction technology will be complemented with additional variants and combined with new package innovations.
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