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High-density PCB stacking connectors
10 October 2018, Interconnection

The Amphenol ICC BergStak Lite 0,8 mm vertical mating PCB-to-PCB connector system is economical yet versatile, with a multiplicity of configuration options. It is particularly well suited to high-speed, high-density parallel board stacking applications in IP phones, measurement equipment, point-of-sale (POS) terminals, portable industrial terminals, security systems and test equipment.

The connector system includes straight PCB headers and sockets with a choice of 40, 60, 80 or 100 contact positions arranged at 0,8 mm pitch in 1 to 4 rows. A choice of 16 PCB stacking heights is available, in 1 mm increments from 5 mm to 20 mm. Design engineers are thus provided with a consistent mating interface across a wide variety of formats to support evolving designs and mechanical requirements.

Depending on stack height, BergStak Lite can support data rates of up to 12 Gbps – compatible with PCIe version 3 and SAS 3.0 high-speed bus performance. The 0,8 mm contact pitch conserves PCB space for high-density applications.

Economical gold flash plating on the contact areas supports 50 mating cycles, while a scoop-proof housing prevents terminal damage due to reverse mating. Optional PCB locator pegs help ensure easy, accurate manual assembly. BergStak Lite has an operating temperature range from –40°C to +125°C and is available in a UL94 V-0 rated, flame retardant LCP (liquid crystal polymer) material. It is RoHS compliant and lead free.

RS Components offers packaging options for BergStak Lite ranging from small packs to tape-and-reel for full-scale manufacture.


Credit(s)
Supplied By: RS Components (SA)
Tel: +27 11 691 9300
Fax: +27 11 466 1577
Email: sales.za@rs-components.com
www: www.rsonline.co.za
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