14 November 2018
Telecoms, Datacoms, Wireless, IoT
Silicon Labs has launched the next-generation Z-Wave 700 on its Wireless Gecko platform, delivering on the platform integration roadmap following its acquisition of Z-Wave technology in April 2018. The new smart home platform builds on Z-Wave's advanced S2 security and interoperability by improving energy efficiency and adding higher-performance, longer-range RF capabilities.
Z-Wave 700 combines a powerful ARM processor-based platform with large on-chip memory to enable greater intelligence at the edge and secure inclusion in less than one second. The energy-efficient platform delivers 10-year coin-cell battery life, enabling more wireless sensor applications. Enhanced RF performance extends device range beyond traditional limits to the edge of the yard and throughout a multi-story home.
Z-Wave 700 also includes SmartStart, providing an easy way to automatically create and configure Z-Wave networks for instant device installation. With no requirements for regionalised SAW filters or external memory, it offers a single global software stock-keeping unit (SKU) for easier logistics and cost-effective global production.
Redefining entry-level MCUs NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...Marktech’s latest LEDs and photodiodes NuVision Electronics
Test & Measurement
Designed for precision sensing and emission tasks, Marktech’s optoelectronic lineup serves medical, industrial, aerospace, and environmental markets.
Read more...Why bis means business for LTE Cat 1 IoT connections NuVision Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.
Read more...Bluetooth Lite SoCs purpose built for IoT NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...X-band radar RF Design
Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version