Products of the Year

16 November 2005 News

T&M products win high recognition

First 16-bit DAC to achieve a sample rate of 1 Gsaps

u-blox delivers millionth GPS receiver

SBC lineup includes small embedded motherboard form factor

MCU is a 'tiny' dynamo

Radical new architecture for CPLDs

Record function density for microcontroller

SAW resonators two-in-one for increased safety

Third-generation devices move flash into the mainstream

New digital signal controller family launched

Single-piece surface mount NVSRAM module has integrated realtime clock

World's highest density FPGA claimed

Single choke coil does the job of three components

Single cycle 8051 core provides performance boost

New high-voltage power transistors set records

World's smallest dual axis accelerometer with I²C interface

Ultracompact GSM/GPRS and GPS combined module

Multidiscrete modules save space

Single-package ZigBee solution said to be a first

GPS signal tracking technology is indoor-capable

Full spectrum 1 W LED module backlighting and general illumination

Complete 10Gig-Ethernet over copper cabling solution

Relays entered fifteenth year of continuous testing without single failure

Second-generation ZigBee solution speeds time-to-market

Rotary position sensor with 360° electrical angle

New compression coax board-to-board RF connector

Adding speech and voice recognition to any product made easy

Lead-free manual soldering easier with underheating

World's smallest Ethernet controller

Innovative silent 10 A relay

New ceramic capacitors have reduced short-circuit risk

Innovative 15 kV relay reduces cost and size for 30-75 A applications

FM broadcast radio tuner is exceptionally small

Soft termination system for components guards against crack failures

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

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Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

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AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

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European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

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Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

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Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

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Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

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Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

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AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

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Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...

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