Open SMT assembly standard enjoying strong uptake
18 April 2018
Manufacturing / Production Technology, Hardware & Services
News
A new standard has been developed to enable open, non-proprietary and vendor-independent machine-to-machine communication in SMT assembly lines. The Hermes Standard was officially launched at Productronica 2017, during which time the body responsible for its creation – the Hermes Standard Initiative – also held its first formal meeting.
Based on TCP/IP and XML, Hermes provides flexible data structures to seamlessly exchange all essential types of board-related data such as dimensions and different ID types. Keeping track of every board being assembled is therefore possible without the need for repeatedly reading barcodes or other ID tags again at each machine.
The standard can be adopted by any equipment manufacturer without any licence fee, and already counts nearly 30 vendors among its members, with around a dozen more having committed to join at the next meeting. Version 1.0 was released in April 2017, providing an impressive set of board flow management functions, and future versions will further grow other functionalities, step by step implementing more and more smart processes into electronics manufacturing.
According to the Hermes Standard Initiative, it chose to go the route of an open initiative rather than an IPC working group in order to allow all members to be fast and close to the application. The initiative members can focus on driving the content of the standard rather than struggling with a cumbersome standardisation process.
For electronics manufacturers interested in taking advantage of the benefits the Hermes Standard offers, initial solutions based on the protocol were already presented at Productronica 2017. In addition to that, some initiative members are planning to provide upgrade kits for their existing equipment in the field to support this new standard.
The Hermes Standard Initiative emphasised that the standard drives horizontal integration along the SMT line, rather than vertical integration from the SMT line to an MES. It is not in conflict with IPC’s CfX and Mentor’s OML protocols, but should rather be viewed as a complementary technology for complex production environments. In simpler environments with less demand in terms of process data, traceability, process interlocking etc., the Hermes Standard can, however, act as a standalone solution.
The Hermes standard specification and a test driver are available for free download from the Hermes Standard Initiative’s website.
For more information visit www.the-hermes-standard.info
Further reading:
Transparent rigid PCBs launched on PCBWay
PCBWay
Manufacturing / Production Technology, Hardware & Services
[Sponsored] PCBWay is thrilled to announce a highly anticipated new service - transparent rigid PCBs – a combination of technology and aesthetics.
Read more...
20 years of precision, progress and purpose – the Jemstech journey
Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...
An argument to redefine IPC class definitions for class 1, 2, & 3 electronics
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...
Large platform stencil printer
Techmet
Manufacturing / Production Technology, Hardware & Services
GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...
Press-fit component inspection
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...
A new era in wire bond inspection
Techmet
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
Read more...
High-speed, high-resolution material deposition system
Manufacturing / Production Technology, Hardware & Services
ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025.
Read more...
Mycronic’s MYPro A40 pick-and-place solution
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
Mycronic’s MYPro A40 pick-and-place solution, equipped with an MX7 high-speed mounthead technology, increases top placement speeds by 48% over the previous generation.
Read more...
Why ergonomics matters in digital microscopy
TANDM
Manufacturing / Production Technology, Hardware & Services
While magnification technology has kept pace with demand, the wellbeing of the people behind the microscopes has often been overlooked with technicians spending long hours in intense focus, leading to chronic strain, fatigue, and costly mistakes.
Read more...
From ER to effortless: The 15-year journey of Seven Labs Technology
Seven Labs Technology
Editor's Choice Manufacturing / Production Technology, Hardware & Services
What started as a business likened to an ‘ER’ for electronic components has today grown into a trusted partner delivering kitting services and full turnkey solutions – taking the effort out of electronics and helping customers truly ‘Move to Effortless.’
Read more...