Coupled inductor for high-performance applications 30 May 2025 This coil with MnZn core is characterised by its high permeability and extremely low RDC values, which achieves excellent power density and very high efficiency.
Power inductors 30 April 2025, iCorp Technologies he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
SMT power inductors 30 April 2025, Future Electronics The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.
Large capacitance MLCCs at 100 V 30 April 2025, RS South Africa TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors to 10 µF at 100 V in 3225 size.
Film and mica capacitors 30 April 2025, Actum Electronics By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Power-over-coax inductors 30 April 2025, RS South Africa TDK has expanded the ADL3225VF series of wire-wound inductors for automotive power-over-coax (PoC).
Thick film power resistors 30 April 2025, Electrocomp Vishay has released a new product to the market, its thick film power resistor, which is offered in a clip-mount TO-247 package.
Compact EMI suppression capacitors 30 April 2025, RS South Africa These new components from TDK are 20% smaller than previous models and meet Grade III Test B standards for temperature, humidity, and bias.
HiRel components from Kyocera AVX 28 March 2025, Electrocomp Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.
Tiny power inductor for low noise applications 28 February 2025, iCorp Technologies With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
3,75 GHz RF inductor 29 November 2024, RF Design The ceramic chip wire wound inductor from Coilcraft features a DC resistance of 1 O, a DC current of 175 mA, and a self-resonant frequency of 3,75 GHz.
Upgraded power inductor series 29 November 2024, iCorp Technologies Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications.
Advanced high-voltage capacitors 31 October 2024, RS South Africa These new capacitor families from Panasonic are designed for surface-mount and radial lead applications, offering remarkable performance improvements that meet the evolving needs of industrial applications.
Chip capacitors for high-voltage applications 31 October 2024, RS South Africa TDK Corporation has expanded its line of CeraLink capacitor series B58043 in the EIA 2220 footprint by adding two new 900 V types.
Moulded inductors 31 October 2024, Future Electronics Abracon’s mini-moulded inductors bring all the advantages of their larger counterparts, including superior EMI shielding, high power density, and low core losses, despite their compact size.
New components from KEMET available from TME 31 October 2024 Available from KEMET, one of the largest suppliers of passive components, these new components consist of toroidal inductors (ferrites) and capacitors which boast high current performance.
Miniature reed relay with 80 W rating 30 September 2024 Pickering Electronics has introduced its latest high-power reed relay, Series 44, featuring an 80 W power rating, while stacking on a compact 0,25-inch pitch.
The future of on-board charging 30 September 2024, Future Electronics Engineered to elevate charging performance, the selection of Vishay capacitors, resistors, and other passives redefine reliability and efficiency in on-board charging technology.
Cooling on a chip 30 September 2024 This all-silicon, solid-state active cooling chip by xMEMS is designed for thermal management applications for ultra-mobile devices and next-gen AI solutions.
First 100 µF MLCC in 0603 packaging 30 August 2024, RS South Africa Murata is expanding its range of multilayer ceramic capacitors (MLCC) with the groundbreaking new GRM188C80E107M and GRM188R60E107M.
