AI & ML

• AI-native IoT platform launched
• Banana Pi with NPU

• ESP32-P4 high-performance MCU
• SolidRun unveils new SoM
• xG26 sets new standard in multiprotocol wireless device performance

Circuit & System Protection

• Clearing the Static: Understanding the significance of ESD audits

• Microchip introduces ECC608 TrustMANAGER

Computer/Embedded Technology

• Microsoft Windows IoT on ARM

DSP, Micros & Memory

• 8-bit MCU with I3C support
• An evolutionary step in customisable logic
• Enhanced code protection for USB µC portfolio
• General-purpose MCU with RISC-V architecture
• MCU for battery-powered applications

• MIKROE’s IDE now includes MPLAB XC compilers
• Qi2 dsPIC33-based reference design
• Serial SRAM up to 4 MB
• SiP supports LTE/NB-IoT and GNSS
• The 8-bit survival syndrome – Part 2

Interconnection

• Compact power relays
• Digital link 40x faster than broadband Internet

• Modular CAT7 inter-car-connection
• Multi-channel cable assembly

Manufacturing / Production Technology, Hardware & Services

• ITW EAE wins product introduction award

• The impact of ML in robotics

Passive Components

• PCB connectors for power systems
• Polymer caps with very high ripple current capability

• SPE connector range
• TDK expands MLCC series

Power Electronics / Power Management

• 5 kW switching PSU range
• AC-DC brick PSU

• Compact PCB-mount SMPS
• Reliable charging range

Telecoms, Datacoms, Wireless, IoT

• 4G LTE-M/NB-IoT connectivity reference design
• Full sensor to cloud solution
• Long-range connectivity module

• Long-range Wi-Fi HaLow module
• Quectel launches 3GPP NTN comms module
• SIMCom’s A7673x series

Test & Measurement

• High-speed AWG generates up to 20 sine waves