Texas Instrument's RFid Systems (TI-RFid), a leading integrated manufacturer of radio frequency identification (RFID) tags, smart labels and reader systems, has developed a highly flexible and secure ISO/IEC 14443 Type B technology platform for proximity payment transactions. The company is currently sampling a low-cost standards-based proximity coupling device (PCD) reader module to key customers and is developing proximity integrated circuit card (PICC) chips, which will be fully compliant with ISO/IEC 14443 Type B, parts one through four.
The ISO/IEC 14443 standard allows for increased security due to a much faster rate of data exchange, as required for financial transactions. This enables transaction information to be securely stored on the RF chip and securely transmitted over the contactless interface. American Express, Mastercard and Visa have endorsed the ISO/IEC 14443 standard for contactless payment applications.
Texas Instruments says that the new platform is easy to implement and highly scalable to meet the current and evolving needs of the wireless payment market. The chip features include a flexible and configurable memory architecture and file system that support multiple applications, and dynamic encryption capability using NIST approved Triple DES and SHA-1 crypto algorithms. The chip can be packaged into various forms from ISO 7810 cards to innovative custom three-dimensional tokens such as keyfobs, using TI's extensive expertise in custom token manufacturing.
For more information contact Gyula Wendler, Arrow Altech Distribution, 011 923 9600, [email protected]
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.