Renesas Technology has developed a 5-layer stacked SiP (system in package) that incorporates a SuperH microprocessor, logic LSI chip and memory chips in a single package.
Increasing the current maximum number of stacked chips in a SiP from three to five, Renesas says it offers users a wider choice of chip combinations while enabling the mounting area to be reduced by approximately 70 to 80%. The device is suited for digital consumer products, such as digital video and still cameras, PDAs and mobile phones.
The 5-layer stacked SiP enables greater flexibility in creating a suitable configuration for a particular system. The stack structure enables the mounting area to be reduced compared with the use of individual packages. The device can also reduce system development times; using existing chips, the SiP can be developed in approximately five to six weeks from final specification to sample delivery, claims the company. The SiP also offers lower EMI noise and therefore more stable high-speed operation due to the reduced wiring length between chips.
Renesas currently mass-produces flat-type SiPs and 2-layer/3-layer stacked SiPs incorporating microcomputer chips such as a SuperH microprocessor, M16C or M32C microcontroller, and memory, such as synchronous DRAM or flash memory, in a single package. It is pursuing the development of SiPs as part of its SIP (solution integrated product) offering to users.
Adaptive optics’ power solution Altron Arrow
Opto-Electronics
Vicor power-dense adaptive optical modules enable colossal telescopes to look into the past for deep space discoveries.
Read more...Wide input voltage buck-boost converter Altron Arrow
Power Electronics / Power Management
The MAX77859 from Analog Devices is a high-efficiency, high-performance buck-boost converter targeted for systems requiring a wide input voltage range of between 2,5 and 22 V.
Read more...High-performance processor for edge-AI Altron Arrow
DSP, Micros & Memory
The STM32MP23 microprocessor from STMicroelectronics is the latest addition to the STM32MP2 series, designed to meet the demands of industrial, IoT, and edge AI applications.
Read more...6 GHz power amplifier Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Analog Devices’ ADPA1116 is a 0,3 to 6 GHz GaN-based power amplifier with a saturated output power (POUT) of 39,5 dBm.
Read more...STM releases innovative GNSS receiver Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics recently introduced the Teseo VI family of global navigation satellite system receivers aimed at high-volume precise positioning use cases.
Read more...Integrated STM32WBA6 wireless microcontrollers Altron Arrow
DSP, Micros & Memory
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.
Read more...High-voltage IGBT Hi-Q Electronics
Power Electronics / Power Management
Diotec Semiconductor has launched the DIW030M060 IGBT, a 600 V, 30 A device with a built-in reverse diode.
Read more...Ultra-low-power MCU with FPU Arm Cortex-M33 Altron Arrow
DSP, Micros & Memory
STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.
printer friendly version