Renesas Technology has developed a 5-layer stacked SiP (system in package) that incorporates a SuperH microprocessor, logic LSI chip and memory chips in a single package.
Increasing the current maximum number of stacked chips in a SiP from three to five, Renesas says it offers users a wider choice of chip combinations while enabling the mounting area to be reduced by approximately 70 to 80%. The device is suited for digital consumer products, such as digital video and still cameras, PDAs and mobile phones.
The 5-layer stacked SiP enables greater flexibility in creating a suitable configuration for a particular system. The stack structure enables the mounting area to be reduced compared with the use of individual packages. The device can also reduce system development times; using existing chips, the SiP can be developed in approximately five to six weeks from final specification to sample delivery, claims the company. The SiP also offers lower EMI noise and therefore more stable high-speed operation due to the reduced wiring length between chips.
Renesas currently mass-produces flat-type SiPs and 2-layer/3-layer stacked SiPs incorporating microcomputer chips such as a SuperH microprocessor, M16C or M32C microcontroller, and memory, such as synchronous DRAM or flash memory, in a single package. It is pursuing the development of SiPs as part of its SIP (solution integrated product) offering to users.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
Read more...The 6 GHz band radio solution Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Analog Devices’ 16 nm transceiver family offers a highly integrated solution for this new frequency band, featuring low power consumption and high performance.
Read more...New clock generator family Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Based on Skyworks’ fifth generation DSPLL and MultiSynth technologies, these devices enable any-frequency, any-output clock generation.
Read more...Dual accelerometers on the same die Altron Arrow
Analogue, Mixed Signal, LSI
The LSM6DSV320X is the first mainstream inertial sensor to house a gyroscope alongside two accelerometers, one capable of sensing up to ±16 g and one sensing up to a staggering ±320 g.
Read more...Ultra-low-power wireless module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WBA5MMG from STMicroelectronics is an ultra-low-power, small form factor, certified 2,4 GHz wireless module that supports Bluetooth LE, Zigbee 3.0, OpenThread, and IEEE 802.15.4 proprietary protocols.
Read more...16-channel multicell battery monitor Altron Arrow
Power Electronics / Power Management
The ADBMS6830B is a multicell battery stack monitor that measures up to 16 series-connected battery cells with a lifetime total measurement error of less than 2 mV.
Read more...Bringing Bluetooth Channel Sounding to automotive and beyond with KW47 Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.
Read more...Wi-Fi 6 and Bluetooth LE coprocessor module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.