Interconnection


Front I/O connector increases board edge density

3 November 2004 Interconnection

Designed to meet the stringent demands of rack-mounted telecommunications equipment, the Densi-Shield I/O connector system from FCI offers eight pair connectors providing a reduced side-by-side pitch of 12,5 mm and PCB level EMC protection.

This assures data transmission speeds up to 2,5 Gbps and beyond.

Creating front I/O connections for 15 mm pitch plug-in units, Densi-Shield I/O provides high-speed interconnections between plug-in units stacked within the same rack or adjacent racks and cabinets. The connector's shorter cable exit length also helps avoid contact with cabinet doors. Combining a right angle board connector and straight cable connector, it makes use of shielded plastic wafers carrying two signal pairs separated by an optional ground pin, with four wafers providing eight pairs, or four bi-directional channels per connector assembly. The modular nature of this approach means that other connector pin counts are readily achieved.

A high level of protection against EMI is provided. The metal housing features all-round surface mount pads for direct PCB soldering, and sprung tabs ensure grounding with both the panel and cable connector. The cable connector includes the option of a Torx head, hexagonal or thumb-tightenable locking screw. Its double ferrule crimp system and a robust back shell ensure continuity in EMI protection and provide enhanced cable strain relief.

Designed to simplify PCB assembly, the Densi-Shield I/O right-angle connector's single piece construction supports automatic component insertion, while its pin-in-paste compatible signal and ground pins meet the requirements of standard and lead-free surface mount solder processes.

For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]



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