Infineon Technologies has revealed the world's first CMOS single-chip RF transceiver that supports all six frequency bands for UMTS (Universal Mobile Telecommunications System) now specified for operation in different parts of the world. The new SMARTi 3G is the first chip available to comply with category 8 of the HSDPA specification (High Speed Downlink Packet Access between base station and mobile device) featuring up to 7,2 Mbps. Today's UMTS phones without HSDPA allows 384 Kbps. Additionally, SMARTi 3G's package size is just 5 x 5 mm - 30% less than the packages of UMTS single-band RF transceivers. The SMARTi 3G is designed to fulfil the W-CDMA UTRA FDD system requirements for the frequency bands I to VI. It is manufactured using Infineon's standard 130 nm, CMOS process technology.
Quectel partners with GEODNET Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has partnered with GEODNET to deliver Quectel’s Real-Time Kinematic (RTK) correction services, enabling high-precision positioning for IoT applications.
Read more...Bringing Bluetooth Channel Sounding to automotive and beyond with KW47 Altron Arrow
Telecoms, Datacoms, Wireless, IoT
NXP’s new Channel Sounding-certified KW47 and MCX W72 wireless MCUs are set to help automakers with distance measurement, bringing an additional ranging solution for car access and autonomous systems, and will be utilised across a broader spectrum of applications.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...Wi-Fi 6 and Bluetooth LE coprocessor module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The ST67W611M1 from STMicroelectronics boasts an all-in-one design which, together with its capabilities, contribute to making it an attractive choice for IoT edge devices requiring a single-chip solution.
Read more...Futureproofing IoT connectivity SIMcontrol
Telecoms, Datacoms, Wireless, IoT
A managed private APN assigns every device to an isolated carrier slice, producing a single ingress to the enterprise network, with traffic bypassing shared internet paths and reducing exposure.
Read more...Extra slim 2,4 GHz radio module
Telecoms, Datacoms, Wireless, IoT
The Thyone I radio module from Würth Elektronik now has a little sibling: Thyone-e, which takes up 30% less space and represents a cost-effective alternative for applications in which the long-range mode is not required.
Read more...Wi-Fi 6 plus Bluetooth LE SoC Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Silicon Labs’ SiWx917M SoC is the company’s lowest power Wi-Fi 6 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi, Bluetooth, Matter, and IP networking for secure cloud connectivity.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...Two Bluetooth protocols – one module
Telecoms, Datacoms, Wireless, IoT
Würth Elektronik has introduced its Skoll-I, a compact wireless module that combines both Bluetooth Classic and Bluetooth Low Energy version 5.4 into a single solution.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version