Royal Philips Electronics' new LPC210x series, based on the ARM7 TDMI-S architecture, can operate at speeds up to 70 MHz (63 MIPs), 10 MHz faster than the current fastest ARM7 MCUs on the market, according to the company. Philips has added the LPC2101, LPC2102 and the LPC2103 to its popular LPC2000 MCU family. The MCUs' feature fast I/O capabilities, which allow bit-toggling at a speed of 17,5 MHz, four times faster than other ARM MCUs on the market, claims Philips. In addition, innovative power management features allow power-down mode current consumption - with the realtime clock running - to be less than 10 μA. On-board communication peripherals include two 16C550-compatible UARTs, two fast I²C-bus interfaces, two SPI/SSP interfaces, four timers with PWM capability and a 10-bit ADC. Based on ARM7, the LPC2000 family offers users comprehensive tools and development support environments from traditional 8-bit and 32-bit partners.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
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The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
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Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
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Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
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Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
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Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
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DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
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