ADSP-BF537 Stamp board support package

16 November 2005 DSP, Micros & Memory

The BF537 Stamp Board Support Package (BSP) from Analog Devices provides developers with a cost-effective environment to develop embedded systems with the Blackfin Processor. The Stamp BSP has been specifically designed to support the development and porting of open source uClinux applications and includes the full complement of memory along with serial and network interfaces.

The BSP includes an ADSP-BF537 Stamp board and a CD with a recent copy of the Blackfin open source development tools and uClinux Kernel, documentation, board schematics, gerbers, and layout files. There are several Analog Devices daughter cards available for use with the stamp board such as the AD7476, AD7476A, and AD7940.

Supported technologies are: networking/Ethernet; OS testing with Linux Test Project (LTP). Applications areas are for VoIP, and network communications and control.

Further reading:

Cost-effective microcontroller series
Altron Arrow DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.

Read more...

---

Battery-friendly Thread and BLE solution
iCorp Technologies DSP, Micros & Memory
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.

Read more...

---

Next generation HMI processing platform
Future Electronics DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.

Read more...

---

Low-power SoC for IoT designs
iCorp Technologies DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.

Read more...

---

Chip for high-density power
Future Electronics DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.

Read more...

---

The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.

Read more...

---

GigaDevice expands GD25UF Series density
NuVision Electronics DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.

Read more...

---

ARINC 429 line driver evaluation board
ASIC Design Services DSP, Micros & Memory
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.

Read more...

---

Highly integrated 24-channel mixed signal IC
EBV Electrolink DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.

Read more...

---

Lower-power Thread and BLE connectivity
iCorp Technologies DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.

Read more...

---